Robert Boschgmbh

Ludger Olbrich

Anton Doering

Gerhard Conzelmann

Gerhard Fiedler

A standard lead frame has a carrier pierced to produce an opening sufficiently large to make room therein for the mounting of a semiconductor circuit chip. A heat sink for the semiconductor circuit chip is fastened into position in or just below the opening. The semiconductor circuit chip is then affixed directly to the heat sink. After wires have been bonded to connect contact areas of the chip to the conducting paths on the lead frame the unit is encapsulated in such a fashion that a major surface of the heat sink protrudes from the encapsulation. A standard lead frame may be used as the carrier.

Electronic circuit component with heat sink mounted on a lead frame

A monolithic integrated power transistor chip includes a plurality of transistor cells arranged in two opposite and mutually spaced rows. Each cell has emitter- and collector connection spots arranged side-by-side and connected to corresponding branch conductors directed by rows of connection points extending along opposite edges on the upper surface of the chip.

Power transistor monolithic integrated structure

A standard lead-frame has an aperture pierced to produce an opening sufficiently large to make room therein for the mounting of a semiconductor circuit chip. A heat sink for the semiconductor circuit chip is fastened into position in or just below the opening. The semiconductor circuit chip is then affixed directly to the heat sink. After wires have been bonded to connect contact areas of the chip to respective parts of the lead frame the unit is encapsulate such a fashion that a major surface of the heat sink protrudes from the encapsulation.

Growing community of inventors

Reutlingen, Germany

Ludger Olbrich