Gemalto Sa

Gemplus

Thales Dis France Sa

Thales Dis France Sas

Lucile Dossetto

Jean-Christophe Fidalgo

Frédérick Seban

Jean-Luc Lesur

Line Degeilh

Stéphane Ottobon

Thierry Laviron

Remy Janvrin

Arek Buyukkalender

Thierry Karlisch

Nizar Lahoui

Stephane Ottobon

Alain Le Loc'h

Catherine Brondino

Laurent Audouard

Jean-Charles Biremont

Remi Garnier

Laurent Valette

Laurent Leloup

JeanChristophe Fidalgo

Luc Charles

Sebastien Guijarro

Lionel Merlin

Laurence Robertet

Sébastien Guijarro

Rémi Garnier

The invention relates to a module with integrated circuit chip, comprising an insulating substrate, metallisations comprising conductive tracks produced on one side of the substrate, forming an antenna and comprising two connection ends, and a coating area or location of the radiofrequency integrated circuit chip and of a device in the form of a surface-mounted device, the radiofrequency integrated circuit chip and the device being disposed on the same face of the substrate and connected to the antenna. The metallisations are on a single same side of the insulating substrate, the connection being made by means of perforations through the insulating film or directly on the surface metallisations.

Single-face antenna module comprising CMS device

The invention relates to a method for manufacturing a device with a secure integrated-circuit chip, said device having an insulating substrate, electrically conductive surfaces on the substrate, which surfaces are connected or coupled to said electronic chip, said electrically conductive surfaces being produced by a step of depositing or transferring conductive material; the method is characterised in that said step of depositing or transferring conductive material is carried out by a technique of directly depositing metal microparticles, which are free of polymer or solvent, onto the substrate, said deposit being obtained by coalescence of the microparticles forming at least one or more uniform cohesive layers that rest directly in contact with the substrate. The invention also relates to the device obtained.

Method for manufacturing a device with integrated-circuit chip by direct deposit of conductive material

The invention relates to a method for producing a module having an electronic chip including metallizations which are accessible from a first side of the metallizations and an integrated circuit chip which is arranged on the second side of the metallizations, opposite the first side. The method comprises the step of forming electrical interconnection elements which are separate from the metallizations, directly connecting the chip, and are arranged on the second side of the metallizations. The invention also relates to a module corresponding to the method and to a device comprising said module.

Method for producing a single-sided electronic module including interconnection zones

The invention relates to an electronic module comprising a first metal layer including at least one contact pad or a conductive pad for connection or interconnection, an insulating layer that is electrically connected to the metal layer via a first surface, a second metal layer connected to the insulating layer on the opposite surface thereof, a chip location or an electronic chip electrically connected to the at least one contact pad through openings in the insulating layer, characterized in that the insulating layer is an adhesive.

Dielectric filmless electronic module and method for manufacturing same

The present invention relates to a smart card comprising a card body and an electronic module placed within a recess of the card body and further comprising at least one colored layer placed between the electronic module and the bottom of the recess of the card body.

Smart card and method of production

The invention relates to a portable electronic device comprising a supporting member receiving on one side conductive contact lands or tracks extending substantially as far as the edge of the side and connecting an electronic microcircuit, the conductive contact lands or tracks comprising a plurality of perforations. The device is noteworthy in that the interior of the perforations is free, or intended to be kept free, of metal.

Portable device with apertured electrical contacts

This invention relates to a smart card () manufacturing method that makes it possible to reduce the thickness of the said smart card and directly obtain a final 3FF or 4FF format. The smart card manufacturing method comprises steps for depositing resin forming a first protective coat () over the electronic element assembly with a surface greater than the required smart card format and depositing a second protective coat with a format larger than the required card format on the first protective coat. The second protective coat is fixed to the first protective coat by curing the first protective coat, and then the assembly obtained in that way is cut to the required format.

Method for manufacturing smart cards

The invention concerns a USB-key type electronic device () comprising an electronic circuit mounted on a support (), a gripping element showing a graphic print and/or customization (p), a protective case () arranged at the element so as to cause the graphic print and/or customization to be visible through the case. The invention is characterized in that the graphic print and/or customization is produced on the support () bearing the electronic circuit, and in that the case covers directly said support (). The invention also concerns a method including the following steps: producing an electronic circuit support in the form of a printed smart card with contacts in conformity with the USB standard, producing a graphic customization on a support surface, protecting said graphic customization with a transparent protective shell.

Personalized USB-key type electronic device and method for making same

In a method for manufacturing a contact chip card, a dielectric support film is provided in the form of a strip. A metal grid which defines contact pads on the upper surface thereof and connection pads on the lower surface thereof is created. The dielectric support film is irremovably fixed on the upper surface of the metal grid in such a way that the contact pads of the grid are free. The chip is glued and connected to the connection pads of the grid, and the metal grid is cut to obtain a micromodule to be inserted in the cavity of a body of the card. In one particular embodiment, the grid is arched in order to encase the thickness of the dielectric.

Method for producing contact chip cards with a low-cost dielectric

An integrated circuit card includes a card body having an integrated circuit electrically connected to contact pads formed by electrically conductive ink. An interface terminal strip provided with a series of terminals is electrically connected to the integrated circuit contacts. The contact pads are formed on the card body upper surface such that each pad comprises a portion which covers, at least partially, a terminal of the interface terminal strip.

Integrated circuit card comprising an interface terminal strip and method for making same

In a method for the production of a portable integrated circuit electronic device, an integrated circuit chip is transferred onto a dielectric support and connected to a metal grid comprising contact pads and connection pads. A housing is created for the chip on a metal grid by arching the grid. The dimensions of the housing enable the housing to accommodate the thickness of the card and the contact pads thereof. The grid is laminated on the dielectric support, whereby each contact pad of the card can be placed opposite to and in contact with the connection pads of the grid.

Growing community of inventors

Gemenos, France

Lucile Dossetto