Micron Technology Incorporated

Other

Lucien J Bissey

Kevin G Duesman

Bryan C Carson

Thomas W Voshell

Mark L Hadzor

William Arthur Stanton

Gordon D Roberts

Warren M Farnworth

Methods, apparatuses, and systems related to data management and security in a memory device are described. Data may be stored in a memory system, and as part of an operation to move data from one region to another in the memory system, the data may be validated using one or more hash functions. For example, a memory device may compute a hash value of some stored data, and use the hash value to validate another version of that stored data in the process of writing the other version stored data to a region of the memory system. The memory device may store another hash that is generated from the hash of the stored data and a record of transactions such that transactions are identifiable; the sequence of transactions within the memory system may also be identifiable. Hashes of transactions may be stored throughout the memory system or among memory systems.

Data integrity protection for relocating data in a memory system

The invention includes semiconductor constructions containing optically saturable absorption layers. An optically saturable absorption layer can be between photoresist and a topography, with the topography having two or more surfaces of differing reflectivity relative to one another. The invention also includes methods of patterning photoresist in which a saturable absorption layer is provided between the photoresist and a topography with surfaces of differing reflectivity, and in which the differences in reflectivity are utilized to enhance the accuracy with which an image is photolithographically formed in the photoresist.

Semiconductor constructions

A memory structure has a vertically oriented access transistor with an annular gate region. A transistor is fabricated such that the channel of the transistor extends outward with respect to the surface of the substrate. An annular gate is fabricated around the vertical channel such that it partially or completely surrounds the channel. A buried annular bitline may also be implemented. After the vertically oriented transistor is fabricated with the annular gate, a storage device may be fabricated over the transistor to provide a memory cell.

Random access memory device utilizing a vertically oriented select transistor

Methods of patterning photoresist, and methods of forming semiconductor constructions

A memory structure having a vertically oriented access transistor with an annular gate region and a method for fabricating the structure. More specifically, a transistor is fabricated such that the channel of the transistor extends outward with respect to the surface of the substrate. An annular gate is fabricated around the vertical channel such that it partially or completely surrounds the channel. A buried annular bitline may also be implemented. After the vertically oriented transistor is fabricated with the annular gate, a storage device may be fabricated over the transistor to provide a memory cell.

Annular gate and technique for fabricating an annular gate

Method of fabricating a random access memory device utilizing a vertically oriented select transistor

An integrated circuit includes a first conductive layer, an insulator layer disposed on the first conductive layer, and a second conductive layer disposed on the insulator layer. A first fuse is disposed in the first conductive layer and provides a first signal, and a second fuse is disposed in the second conductive layer in alignment with the first fuse and provides a second signal.

Methods for forming aligned fuses disposed in an integrated circuit

A packaged integrated circuit device with a multi-level leadframe has a plurality of integral capacitors formed by placing a thin dielectric layer between a lower leadframe and an upper leadframe, one of the leadframes being subdivided into a plurality of portions, each subdivided portion with an accessible tab for wire attachment. The planar capacitors are bonded to the bottom surface of the semiconductor chip and act as a die support paddle. Each capacitor may be configured to provide the desired voltage decoupling and noise suppression for a particular portion of the integrated circuit to which it is connected. Capacitors useful for other purposes may be likewise provided in the package.

Growing community of inventors

Boise, ID, United States of America

Lucien J Bissey