Sicpa Holding Sa

Telecom Italia S.p.a.

Olivetti S.p.a.

Lucia Giovanola

Paolo Schina

Silvia Baldi

Renato Conta

Anna Merialdo

Silvano Tori

Danilo Bich

Davide Ciampini

Duccio Spartaco Sassano

Cristina Panciatichi

Oriana Rossotto

Irma Disegna

Agnieszka Kapalka

Jean-Luc Dorier

Tazio Sandri

Lorenzo Sirigu

Mia Milos-Schouwink

Marco Sarti

Xavier Urbaneja

A multi-chip module (MCM) assembly comprising: a graphite substrate comprising a plurality of silicon chips directly attached to the graphite substrate, and a Printed Wiring Board (PWB) attached to the graphite substrate by means of a solvent-resistant adhesive glue and provided with openings surrounding outer profiles of the silicon chips. A printing bar comprising a plurality of the MCM assemblies is also disclosed.

Multi-chip module (MCM) assembly and a printing bar

The present application relates to a method of manufacturing an ink-jet printhead comprising: providing a silicon substrate () including active ejecting elements (); providing a hydraulic structure layer () for defining hydraulic circuits configured to enable a guided flow of ink; providing a silicon orifice plate () having a plurality of nozzles () for ejection of the ink; assembling the silicon substrate () with the hydraulic structure layer () and the silicon orifice plate (); wherein providing the silicon orifice plate () comprises: providing a silicon wafer () having a planar extension delimited by a first surface () and a second surface () on opposite sides of the silicon wafer (); performing a thinning step at the second surface () so as to remove from the second surface () a central portion () having a preset height (H), the silicon wafer () being formed, following the thinning step, by a base portion () having a planar extension and a peripheral portion () extending from the base portion (), transversally with respect to the planar extension of the base portion (); and forming in the silicon wafer () a plurality of through holes, each defining a respective nozzle () for ejection of the ink. The method according to the present invention is characterized in that the silicon wafer () is a silicon-on-insulator wafer, wherein the silicon-on-insulator wafer comprises a silicon device layer () adjacent to the first surface (), a silicon handle layer () adjacent to the second surface () and an insulator layer () in-between.

Method of manufacturing an ink-jet printhead

A Liquid, comprising an hydrophobic flavonoid derivative electrochemically non-active, that is capable of restoring its electrochemical activity, the concentration of the flavonoid derivative being 10 ppm by weight or less, and an organic substance in an amount of 90% by weight or more.

Method for liquid authentication by detection of flavonoid derivatives

The present invention relates to markers for liquids that can be used to authenticate the origin and genuineness of a liquid, preferably a bulk liquid such as fuel. For this purpose, the present invention teaches the use of a polymer capable of forming a semiconducting polymer particle (pdot) in the liquid in small amounts. The invention encompasses a liquid comprising a) a polymer that is capable of forming a semiconducting polymer particle (pdot), the concentration of the polymer being 10 ppm by weight or less, and b) an organic substance in an amount of 90% by weight or more. The invention furthermore envisages the use of such a polymer as an authenticating marker in a liquid, preferably a fuel, and a method for authenticating the genuineness and/or origin of a liquid comprising a polymer capable of forming a semiconducting polymer particle (pdot), comprising the steps

Liquid containing polymer marker, use of a polymer marker as authentication tool, and method and device for detecting a polymer marker dissolved in a liquid

A method of manufacturing an ink jet printhead includes: providing a silicon substrate including active ejecting elements; providing a hydraulic structure layer; providing a silicon orifice plate having a plurality of nozzles for ejection of the ink; and assembling the silicon substrate with the hydraulic structure layer and the silicon orifice plate. Providing the silicon orifice plate includes: providing a silicon wafer having a substantially planar extension delimited by a first and a second surfaces; performing a thinning at the second surface so as to remove a central portion having a preset height; and forming in the silicon wafer a plurality of through holes, each defining a respective nozzle for ejection of the ink.

Method of manufacturing an ink-jet printhead having frusto-pyramidal shaped nozzles

A method of manufacturing an ink jet printhead includes: providing a silicon substrate including active ejecting elements; providing a hydraulic structure layer; providing a silicon orifice plate having a plurality of nozzles for ejection of said ink; and assembling the silicon substrate with said hydraulic structure layer and said silicon orifice plate. Providing the silicon orifice plate comprises: providing a silicon wafer having a substantially planar extension delimited by a first and a second surfaces; performing a thinning step at the second surface so as to remove a central portion having a preset height; and forming in the silicon wafer a plurality of through holes, each defining a respective nozzle for ejection of the ink.

The present invention relates to an adhesive composition comprising (1) at least one polyol tri(meth)acrylate monomer selected from the group consisting of ditrimethylolpropane triacrylate (DiTMPTTA), tris-(2-hydroxyethyl)-isocyanurate triacrylate (THEICTA), dipentaerythritol triacrylate (DiPETA), ethoxylated trimethylolpropane triacrylate (TMPEOTA), propoxylated trimethylolpropane triacrylate (TMPPOTA), ethoxylated pentaerythritol triacrylate (PETEOIA), propoxylated glyceryl triacrylate (GPTA), pentaerythritol triacrylate (PETA), trimethylolpropane triacrylate (TMPTA) and modified pentaerythritol triacrylate, triethyleneglycol trimethacrylate (TIEGTMA), tetraethyleneglycol trimethacrylate (TTEGTMA), polyethyleneglycol trimethacrylate hexane trimethacrylate (HTTMA) ethoxylated bisphenol A trimethacrylate, and trimethylolpropane trimethacrylate (TMPTMA), (2) at least one polyalkylene glycol mono(meth)acrylate monomer selected from the group consisting of polypropylene glycol monomethacrylate, polyethylene glycol monomethacrylate, polyethylene glycol-polypropylene glycol monomethacrylate, polypropylene glycol-monoacrylate, polyethylene glycol monoacrylate, polypropylene glycol-polytrimethylene monoacrylate, polyethylene glycol-polytetramethylene glycol monomethacrylate, methoxypolyethylene glycol monomethacrylate, yerfluoroalkylethyl-polyoxyalkylene monomethacrylate, and combinations thereof, and (3) at least one radical initiator selected from the group of initiators sensitive to UV and/or blue radiation (photoinitiator) and thermal initiators (thermoinitiator). The adhesive composition is used for assembling elements made of plastic materials, like PMMA or SAN, or inorganic materials, like glass or metals, employed for manufacturing of devices for the distribution of containment of biological substances.

Acrylic adhesive for assembling elements contacting biological substances

The present invention relates to acrylic adhesive composition comprising a mixture of at least one polyol tri(meth)acrylate monomer and at least one polyalkylene glycol mono(meth)acrylate monomer for assembling elements made of plastic materials, like PMMA or SAN, or inorganic material, like glass or metals, employed for manufacturing of devices for the distribution or containment of biological substances, like proteins, enzymes, antibodies, antigens, DNA, and the like. The present invention also relates to devices for the distribution or containment of biological substances assembled with the above mentioned acrylic adhesive composition, and particularly thermal or piezoelectric ejecting devices, and biochip microarray, as well as to a method for assembling thereof.

A process for manufacturing an inkjet print head comprising the steps of providing a print head wafer comprising a plurality of print head dice coated with a barrier layer, each print head die comprising a plurality of actuators and interconnections, the barrier layer comprising a plurality of openings in correspondence with the plurality of actuators and interconnections, providing a debondable SOI wafer comprising a handle layer, a buried layer, and a device layer, forming a protective layer on the surface of the device layer, bonding the device layer to the barrier layer, debonding the handle layer from the SOI wafer, etching the device layer so as to realize a plurality of openings in correspondence with the plurality of actuators and interconnections, and removing the protective layer in correspondence of the plurality of openings.

Ink-jet printhead manufacturing process

An ink jet printhead, made of a silicon substrate and a plurality of metallic and dielectric layers deposited on said substrate. A plurality of chambers for ejection of ink droplets and a plurality of corresponding feeding ducts, connected to the chambers, are produced in a structural layer made of non-photosensitive epoxy or polyamide resin. The chambers and said ducts are delimited by at least one upper wall, the upper wall communicating with at least one nozzle for ejection of the ink droplets. The upper wall and an inner wall of the nozzle are coated with at least one metallic coating layer, suitable for increasing the resistance of the walls to chemically aggressive liquids, in contact with the walls.

Process for protectively coating hydraulic microcircuits against aggressive liquids, particulary for an ink jet printhead

Ink jet printhead comprising one or more ejection module, each with a silicon chip, a plurality of ejector nozzles arranged adjacent to a front of the module, ejection cells for the nozzles and delivery channels for the ink of the cells. The module or modules each include a distribution channel adjacent to the front and in fluid communication with the delivery channels and a nozzle layer integrated with the relative chip and in which the ejector nozzles parallel to the front are made. The head also comprises a support on which the module or modules are mounted and which defines a feeding duct for the ink in fluid communication with the delivery channels and sealing means between the module or modules and the support to guarantee fluid tightness between the feeding duct and the ejection cells.

Ink jet printhead and its manufacturing process

The chambers () and each corresponding ink feeding duct (), made in a structural layer of photosensitive resin (), are delimited by a flat bottom wall () made of a protective layer () of tantalum and gold and an upper wall (), consisting of a substantially concave surface, including at least one ejection nozzle () and joined to the bottom wall along a continuous perimetral line (), in which the inner shape of each of the chambers () and of each of the feeding ducts () represents the complementary impression of the outer form of a sacrificial layer (), obtained from a controlled and non-contained growth of a metal, deposited starting from the dimensions of the layer of gold (), laid on top of the layer of tantalum ().

Ink jet printhead and relative manufacturing process

Process for protectively coating against aggressive liquids hydraulic microcircuits made in a resin, particularly for an ink jet printhead, consisting of: disposing of a silicon substrate comprising a sacrificial layer of copper, deposited on the substrate and defining the inner shape of the hydraulic microcircuits; depositing on top of the outer surface of the sacrificial layer, by means of an electrochemical process, at least one protective, metallic coating layer; applying on the sacrificial layer a non-photosensitive epoxy or polyamide resin, having a predetermined thickness and suitable for completely covering the sacrificial layer; effecting a polymerization of the resin to increase its mechanical resistance to mechanical and thermal stresses and performing a planarization of the outer surface of the resin, by means of a mechanical lapping and simultaneous chemical treatment; removing the sacrificial layer through a chemical etching in a highly acid bath; and depositing a metallic, protective layer on the outer surface of the resin through vacuum evaporation.

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Ivrea, Italy

Lucia Giovanola