Lumentum Operations LLC

Jds Uniphase Corporation

Lucas Morales

An-Chun Tien

Vincent V Wong

Raman Srinivasan

Bryed Billerbeck

Sean Burns

Yuanzhen Zhuang

Tian Shi

Mikhail Dolganov

Siu Kwan Cheung

Tao Li

Suning Xie

Abhinav Rohit

Cho-Shuen Hsieh

Albert Huang

Peter Tran

A characterization circuit for an optical device includes: an optical device, a switch, a switch driver, one or more resistors, and one or more capacitors. The switch driver is configured to receive a trigger pulse from an external pulse generator and to provide the trigger pulse to the switch, which causes the switch to be in an on state. The one or more capacitors are configured to, when the switch is in an off state, receive a charge current (e.g., with a greater than 50 nanoseconds rise time) from an external driver voltage source via the one or more resistors; and, when the switch is in the on state, discharge a current pulse (e.g., with a less than 10 nanosecond pulse width) to the optical device. The optical device is configured to receive the current pulse and to emit, based on the current pulse, an optical output pulse.

Optical device testing system

In some implementations, a probe tip assembly includes a driver printed circuit board assembly (PCBA) and a probe tip subassembly. The probe tip subassembly includes a plurality of probe tips, wherein a probe tip, of the plurality of probe tips, extends beyond an end of the PCBA, and the PCBA and the probe tip are configured to transmit an electric signal to test an optical component. The probe tip may include a material comprising at least one of copper (Cu), a beryllium copper (BeCu) alloy, tungsten (W), Paliney, Neyoro, and/or another conductive material.

Probe tip assembly for testing optical components

A wafer testing system may comprise a chuck, a wafer carrier, a cathode plate, and a probe card. The chuck may be configured to hold the wafer carrier. The wafer carrier may be configured to hold a wafer on a surface of the wafer carrier, wherein the surface of the wafer carrier comprises one or more contact features protruding from the surface of the wafer carrier. The cathode plate may be configured to provide an electrical connection between the wafer carrier and the probe card, wherein a portion of a surface of the cathode plate is configured to be disposed on the one or more contact features of the wafer carrier. The probe card may be configured to test, using one or more probes associated with the probe card, the wafer when the wafer is on the surface of the wafer carrier.

Wafer prober to facilitate testing of a wafer using nanosecond pulses

A time of flight camera device comprises an light source for illuminating an environment including an object with light of a first wavelength; an image sensor for measuring time the light has taken to travel from the light source to the object and back; optics for gathering reflected light from the object and imaging the environment onto the image sensor; driver electronics for controlling the light source with a high speed signal at a clock frequency; and a controller for calculating the distance between the object and the illumination unit. To minimize power consumption and resulting heat dissipation requirements, the light source/driver electronics are operated at their resonant frequency. Ideally, the driver electronics includes a reactance adjuster for changing a resonant frequency of the illumination unit and driver electronics system.

Power efficient pulsed laser driver for time of flight cameras

In order to maximize the dynamic range and depth of field for a depth camera used in a time of flight system, the light source is modulated at a plurality of different frequencies, a plurality of different peak optical powers, a plurality of integration subperiods, a plurality of lens foci, aperture and zoom settings during each camera frame time. The different sets of settings effectively create subrange volumes of interest within a larger aggregate volume of interest, each having their own frequency, peak optical power, lens aperture, lens zoom and lens focus products consistent with the distance, object reflectivity, object motion, field of view, etc. requirements of various ranging applications.

High dynamic range and depth of field depth camera

A time-of-flight (TOF) sensor pixel is provided that performs in-pixel subtraction. The TOF sensor pixel includes a photodetector, a capacitor, and circuitry. The photodetector detects light pulses emitted at a clock frequency, after a time of flight, to provide a photocurrent. The capacitor integrates the photocurrent over an integration period, while the circuitry reverses a flow direction of the photocurrent through the capacitor at twice the clock frequency. At the end of the integration period, the capacitor provides a differential photocharge, corresponding to a capacitor voltage. The capacitor voltage is related to the time of flight of the light pulses and may be used to determine a distance to a target.

Time-of-flight (TOF) system, sensor pixel, and method

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San Francisco, CA, United States of America

Lucas Morales