Ste S.a.s. Di G. Moiraghi & C.

Memc Electronic Materials, Inc.

Ste S.r.l.

Luca Moiraghi

Paolo Maria Moiraghi

Guido Moiraghi

Ezio Bovio

Giovanni Negri

Paride Corbellini

There is described a receiver of at least one radiofrequency modulated signal deriving from an antenna external to the receiver; the receiver comprises a first stage for the low noise amplification of the radiofrequency modulated signal and a demodulation stage of the above-mentioned signal. The receiver comprises a SAW filter adapted to act as a pass band filter about a predetermined frequency for the signal deriving from the first stage, a logarithmic amplifier adapted to amplify the signal deriving from the SAW filter, a peak detector of the output signal of the logarithmic amplifier, means adapted to control the gain of the first stage for the amplification of the radiofrequency modulated signal as a function of the output signal (Vopeak) of the peak detector.

Receiver of radio frequency signals

A driving circuit of a surface wave resonator (X) is described; the resonator comprises a static capacitor (Co) and the driving circuit is adapted to supply a voltage (Vx) to the resonator. The driving circuit comprises reactive means (L) adapted to resonate in combination with said static capacitor (Co) of the resonator at a predetermined frequency (Fo) in the initial driving period of the resonator at said voltage; the driving circuit comprises passive means (R) adapted to determine oscillations at said predetermined frequency (Fo).

Surface acoustic wave driving circuit and oscillator therefor

The method comprises the steps of mounting a first wafer () on the mounting member () and securing the mounting member to the hub () by drawing a vacuum at a first vacuum pressure through the hub; rotating the hub about the hub axis (AH), rotating a polishing pad () mounted on the turntable () about the turntable axis (at), and bringing a surface of the wafer () and the polishing pad into contact with each other. The wafer () is demounted, and the shape of the polished wafer is determined. A second vacuum pressure is selected using the information obtained. A successive wafer is polished according to the same method as the first wafer except that the second vacuum pressure is substituted for the first vacuum pressure. The second vacuum pressure is sufficient to deform the mounting member () thereby deform the wafer to improve the flatness and parallelism of the surfaces of the successive wafer.

Method of polishing wafers

Growing community of inventors

Milan, Italy

Luca Moiraghi