Stmicroelectronics S.r.l.

Stmicroelectronics (crolles 2) Sas

Stmicroelectronics (malta) Ltd

Stmicroelectronics Ltd (malta)

Stmicroelectronics (grenoble 2) Sas

Politecnico Di Milano

Luca Maggi

Mark Andrew Shaw

Antonio Fincato

Piero Orlandi

Alex Gritti

Marco Piazza

Frédéric Boeuf

Marco Del Sarto

Kevin Formosa

Matteo Alessio Traldi

Amedeo Maierna

Salvatore Mario Rotolo

Antonio Canciamilla

Luigi Verga

Federico Giovanni Ziglioli

Sebastiano Conti

Fulvio Vittorio Fontana

Mario Francesco Cortese

Filippo David

Mark Anthony Azzopardi

Kenneth Fonk

Giuseppe Cusmai

Jeremy Spiteri

Giuseppe Andreoni

Luca Piccini

The electronic module has a three-dimensional frame, a printed circuit board and a plurality of electronic devices. The printed circuit board is fixed to the three-dimensional frame and has a plurality of support portions which extend transversely to each other in space. The electronic devices are fixed to the printed circuit board and are operatively coupled to each other. The electronic devices are arranged on at least one support portion of the printed circuit board.

Electronic module carrying a plurality of electronic devices

A method of testing a photonic device includes providing a plurality of optical test signals at respective inputs of a first plurality of inputs of an optical input circuit located on a substrate, combining the plurality of optical test signals into a combined optical test signal at an output of the optical input circuit, transmitting the combined optical test signal through the output to an input waveguide of an optical device under test, the optical device under test being located on the substrate, and measuring a response of the optical device under test to the combined optical test signal. Each of the plurality of optical test signals comprises a respective dominant wavelength of a plurality of dominant wavelengths.

Photonic wafer level testing systems, devices, and methods of operation

An electronic module includes a first die of semiconductor material including a first reflector, a second die of semiconductor material including a second reflector, and a frame including a first supporting portion and a second supporting portion parallel to one another. The first and second dies are carried, respectively, by the first and second supporting portions and are respectively arranged so that the first reflector faces the second supporting portion and the second reflector faces the first supporting portion. An incoming light beam impinges upon the first reflector and is reflected on the second reflector so as to be supplied at output from the electronic module.

Integrated electronic module including two micromirrors, and system including the electronic module

A photonic integrated circuit chip includes vertical grating couplers defined in a first layer. Second insulating layers overlie the vertical grating coupler and an interconnection structure with metal levels is embedded in the second insulating layers. A cavity extends in depth through the second insulating layers all the way to an intermediate level between the couplers and the metal level closest to the couplers. The cavity has lateral dimensions such that the cavity is capable of receiving a block for holding an array of optical fibers intended to be optically coupled to the couplers.

Photonic IC chip

An embodiment apparatus comprises an optically transparent substrate having first and second surfaces; a piezoelectric membrane, arranged at the first surface, that oscillates in response to a light beam propagated through the substrate; at least one reflective facet facing the substrate and arranged at the piezoelectric membrane; and an optical element receiving the light beam at an input end and guiding the light beam towards an output end coupled to the second surface. The optical element incorporates a light focusing path focusing the light beam at a focal point at the piezoelectric membrane, and at least one light collimating path collimating the light beam onto the at least one reflective facet. The optical element guides light reflected from the at least one reflective facet to the input end, the reflected light indicating a position of the optical element with respect to the focal point.

Opto-mechanical transducer apparatus and corresponding method

A photonic testing device includes a substrate, an optical device under test (DUT) disposed over the substrate, and an optical input circuit disposed over the substrate. The optical input circuit includes a first plurality of inputs each configured to transmit a respective optical test signal of a plurality of optical test signals. Each of the plurality of optical test signals includes a respective dominant wavelength of a plurality of dominant wavelengths. The optical input circuit further includes an output coupled to an input waveguide of the optical DUT. The output is configured to transmit a combined optical test signal comprising the plurality of optical test signals.

A method includes providing a semiconductor body comprising a surface with a recessed portion therein. The recessed portion includes a bottom surface. Optical waveguide cores in a first array of optical waveguide cores extend side-by-side at the bottom surface. The method further includes providing a second array of optical waveguide cores over the first array of optical waveguide cores. Optical waveguide cores in the second array of optical waveguide cores extend side-by-side. Each optical waveguide core in the second array of optical waveguide cores is in an adiabatic coupling relationship with a corresponding optical waveguide core in the first array of optical waveguide cores. The method also includes applying an optical waveguide cladding material over the second array of optical waveguide cores.

Method of producing a device for adiabatic coupling between waveguide arrays, corresponding device, and system

An optical integrated circuit device includes a semiconductor substrate and a first waveguide made of a first material and disposed over the semiconductor substrate. The first waveguide includes a parallel region and a tapered region. The optical integrated circuit device further includes a first cladding structure disposed over and surrounding the parallel region of the first waveguide, a first extension made of the first material and disposed over the semiconductor substrate, and an electrostatic discharge (ESD) protection structure electrically coupled to the first extension. The first extension physically contacts the parallel region of the first waveguide. The first extension includes a first portion within the first cladding structure and a second portion outside the first cladding structure.

Optical integrated circuit systems, devices, and methods of fabrication

System for coupling light to integrated devices, comprising a grating coupler which couples light, such as light from a light source, into an optic fiber. The system includes an optic subsystem comprising a transmitter portion receiving the light emitted by the grating coupler and a receiver portion receiving light from the transmitter and focusing the light into the integrated device, the transmitter portion being configured to modify an angle distribution of the light emitted by the grating coupler and the receiving portion being configured to focus the light with modified angle distribution into the integrated device.

System for coupling light to integrated devices and corresponding method

A semiconductor chip provides an optical medium for light propagation. The semiconductor chip includes a chip surface with an outer perimeter and a cavity in the chip surface. The cavity includes a peripheral wall and a bottom surface surrounded by the peripheral wall, the bottom surface adiabatically couplable to an optical waveguide. The cavity is located at an area of the chip surface spaced from the outer perimeter thereof.

Optical semiconductor chip, corresponding arrangement, apparatus and method

An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.

Optoelectronic device having improved optical coupling

An optical integrated circuit device includes an electrically insulating substrate, an optical connection disposed at a boundary of the optical integrated circuit, and a first electrostatic discharge (ESD) protection structure in direct contact with and electrically coupled to the first waveguide. The optical connection includes a first waveguide. The first waveguide is disposed on the electrically insulating substrate and configured to transmit an optical signal. The first ESD protection structure is both electrically non-insulating and substantially optically transparent to the optical signal. An ESD diode including an anode and a cathode is electrically coupled to the first ESD protection structure. A ground connection is electrically coupled to the anode of the ESD diode.

A microelectromechanical device includes: a substrate; a semiconductor die, bonded to the substrate and incorporating a microstructure; an adhesive film layer between the die and the substrate; and a protective layer between the die and the adhesive film layer. The protective layer has apertures, and the adhesive film layer adheres to the die through the apertures of the protective layer.

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Garlate, Italy

Luca Maggi