Stmicroelectronics S.r.l.

Luca Guerinoni

Luca Giuseppe Falorni

Gabriele Gattere

Patrick Fedeli

Alessandro Tocchio

Francesco Rizzini

Matteo Fabio Brunetto

Domenico Giusti

Carlo Valzasina

Giorgio Allegato

Federico Vercesi

Giacomo Langfelder

Lorenzo Corso

Daniele Prati

Fabrizio Cerini

Francesco Braghin

Ferruccio Resta

Damiano Milani

Mohammad Izadi

Leonardo Gaffuri Pagani

Paola Carulli

Nicolò Boni

A gyroscopic sensor unit detects a phase drift between a demodulated output signal and demodulation signal during output of a quadrature test signal. A delay calculator detects the phase drift based on changes in the demodulated output signal during application of the quadrature test signal. A delay compensation circuit compensates for the phase drift by delaying the demodulation signal by the phase drift value.

Method for correcting gyroscope demodulation phase drift

A microelectromechanical gyroscope is provided with a detection structure having: a substrate with a top surface parallel to a horizontal plane (xy); a mobile mass, suspended above the substrate to perform, as a function of a first angular velocity (Ω) around a first axis (x) of the horizontal plane (xy), at least a first detection movement of rotation around a second axis (y) of the horizontal plane; and a first and a second stator elements integral with the substrate and arranged underneath the mobile mass to define a capacitive coupling, a capacitance value thereof is indicative of the first angular velocity (Ω). The detection structure has a single mechanical anchorage structure for anchoring both the mobile mass and the stator elements to the substrate, arranged internally with respect to the mobile mass, which is coupled to this single mechanical anchorage structure by coupling elastic elements yielding to torsion around the second axis; the stator elements are integrally coupled to the single mechanical anchorage structure in an arrangement suspended above the top surface of the substrate.

Microelectromechanical gyroscope with out-of-plane detection movement

A microelectromechanical device includes a substrate, a first structural layer, and a second structural layer of semiconductor material. A sensing mass extends in the first structural layer and is coupled to the substrate by first elastic connections to enable oscillation of the sensing mass in a sensing direction perpendicular to the substrate by a maximum amount relative to a resting position of the sensing mass. An out-of-plane stopper structure includes an anchorage fixed to the substrate and a mechanical end-of-travel structure, which extends in the second structural layer, faces the sensing mass, and is separated therefrom by a gap having a width smaller than the maximum displacement distance of the sensing mass. The mechanical end-of-travel structure is coupled to the anchorage by second elastic connections that enable movement of the mechanical end-of-travel structure in the sensing direction in response to an impact of the sensing mass.

Microelectromechanical device with out-of-plane stopper structure

A microelectromechanical gyroscope includes: the support structure; a sensing mass, coupled to the support structure with degrees of freedom along a driving direction and a sensing direction perpendicular to each other; and a calibration structure facing the sensing mass and separated from the sensing mass by a gap having an average width, the calibration structure being movable with respect to the sensing mass so that displacements of the calibration structure cause variations in the average width of the gap. A calibration actuator controls a relative position of the calibration structure with respect to the sensing mass and the average width of the gap.

Microelectromechanical gyroscope and method for compensating an output thermal drift in a microelectromechanical gyroscope

Embodiments of a Coriolis-force-based flow sensing device and embodiments of methods for manufacturing embodiments of the Coriolis-force-based flow sensing device, comprising the steps of: forming a driving electrode; forming, on the driving electrode, a first sacrificial region; forming, on the first sacrificial region, a first structural portion with a second sacrificial region buried therein; forming openings for selectively etching the second sacrificial region; forming, within the openings, a porous layer having pores; removing the second sacrificial region through the pores of the porous layer, forming a buried channel; growing, on the porous layer and not within the buried channel, a second structural portion that forms, with the first structural region, a structural body; selectively removing the first sacrificial region thus suspending the structural body on the driving electrode.

Method for manufacturing a silicon-based coriolis-force-based flow sensing device, coriolis-force-based flow sensing device, and system for measuring a property of a fluid

The MEMS gyroscope is formed by a substrate, a first mass and a second mass, wherein the first and the second masses are suspended over the substrate and extend, at rest, in a plane of extension defining a first direction and a second direction transverse to the first direction. The MEMS gyroscope further has a drive structure coupled to the first mass and configured, in use, to cause a movement of the first mass in the first direction, and an elastic coupling structure, which extends between the first mass and the second mass and is configured to couple the movement of the first mass in the first direction with a movement of the second mass in the second direction. The elastic coupling structure has a first portion having a first stiffness and a second portion having a second stiffness greater than the first stiffness.

MEMS gyroscope having an improved rejection of the quadrature error

In an embodiment a circuit includes an inertial measurement unit configured to be oscillated via a driving signal provided by driving circuitry, a lock-in amplifier configured to receive a sensing signal from the inertial measurement unit and a reference demodulation signal which is a function of the driving signal and provide an inertial measurement signal based on the sensing signal, wherein the reference demodulation signal is affected by a variable phase error, phase meter circuitry configured to receive the driving signal and the sensing signal and provide, as a function of a phase difference between the driving signal and the sensing signal, a phase correction signal for the reference demodulation signal and a correction node configured to apply the phase correction signal to the reference demodulation signal so that, in response to the phase correction signal being applied to the reference demodulation signal, the phase error is maintained in a vicinity of a reference value.

Inertial measurement circuit, corresponding device and method

The MEMS gyroscope has a mobile mass carried by a supporting structure to move in a driving direction and in a first sensing direction, perpendicular to each other. A driving structure governs movement of the mobile mass in the driving direction at a driving frequency. A movement sensing structure is coupled to the mobile mass and detects the movement of the mobile mass in the sensing direction. A quadrature-injection structure is coupled to the mobile mass and causes a first and a second movement of the mobile mass in the sensing direction in a first calibration half-period and, respectively, a second calibration half-period. The movement-sensing structure supplies a sensing signal having an amplitude switching between a first and a second value that depend upon the movement of the mobile mass as a result of an external angular velocity and of the first and second quadrature movements. The first and second values of the sensing signal are subtracted from each other and compared with a stored difference value to supply information of variation of the scale factor.

MEMS gyroscope with calibration of the scale factor in real time and calibration method thereof

A MEMS gyroscope is equipped with: at least a first mobile mass suspended from the top of a substrate by means of elastic suspension elements coupled to anchor points rigidly fixed to the substrate, in such a manner as to be actuated in an actuating movement along a first axis of a horizontal plane and to carry out a measurement movement along a vertical axis, transverse to the horizontal plane, in response to a first angular velocity acting about a second axis of the horizontal plane, transverse to the first axis. The elastic suspension elements are configured in such a manner as to internally compensate unwanted displacements out of the horizontal plane along the vertical axis originating from the actuating movement, such that the mobile mass remains in the horizontal plane during the actuating movement.

MEMS gyroscope with improved rejection of a quadrature error

An encapsulated device of semiconductor material wherein a chip of semiconductor material is fixed to a base element of a packaging body through at least one pillar element having elasticity and deformability greater than the chip, for example a Young's modulus lower than 300 MPa. In one example, four pillar elements are fixed in proximity of the corners of a fixing surface of the chip and operate as uncoupling structure, which prevents transfer of stresses and deformations of the base element to the chip.

Encapsulated device of semiconductor material with reduced sensitivity to thermo-mechanical stresses

A MEMS sensor device provided with a sensing structure, having: a substrate with a top surface extending in a horizontal plane; an inertial mass, suspended over the substrate; elastic coupling elements, elastically connected to the inertial mass so as to enable inertial movement thereof with respect to the substrate as a function of a quantity to be detected along a sensing axis belonging to the horizontal plane; and sensing electrodes, capacitively coupled to the inertial mass so as to form at least one sensing capacitor, a value of capacitance of which is indicative of the quantity to be detected. The sensing structure moreover has a suspension structure, to which the sensing electrodes are rigidly coupled, and to which the inertial mass is elastically coupled through the elastic coupling elements; the suspension structure is connected to an anchorage structure, fixed with respect to the substrate, by means of elastic suspension elements.

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Alzano Lombardo, Italy

Luca Guerinoni