Sandisk 3d LLC

Stmicroelectronics Gmbh

Matrix Semiconductor, Inc.

Sandisk Technologies Inc.

Sandisk Corporation

Luca Giovanni Fasoli

Roy E Scheuerlein

Tianhong Yan

Alper Ilkbahar

Andrew J Walker

Christopher John Petti

Tyler J Thorp

Gopinath Balakrishnan

Yuheng Zhang

Sucheta Nallamothu

Kenneth K So

En-Hsing Chen

Yan Li

George Samachisa

Tz-Yi Liu

Andrei Mihnea

Stella Matarrese

Masaaki Higashitani

Mark G Johnson

Yung-Tin Chen

Maitreyee Mahajani

Bendik Kleveland

Ali K Al-Shamma

Jeffrey Koon Yee Lee

Aldo Bottelli

Thomas Yan

Igor Koutnetsov

Thomas H Lee

Matthew P Crowley

Cuong Quoc Trinh

Anirban Roy

Oron Michael

Doug Sojourner

A non-volatile storage system includes technology for skipping programming cycles while programming a page (or other unit) of data. While programming a current subset of the page (or other unit) of data, the system will evaluate whether the next subsets of the page (or other unit) of data should be programmed into non-volatile storage elements or skipped. Subsets of the page (or other unit) of data that should not be skipped are programmed into non-volatile storage elements. Some embodiments include transferring the appropriate data to temporary latches/registers, in preparation for programming, concurrently with the evaluation of whether to program or skip the programming.

Program cycle skip

A technique for efficiently handling write operation failures in a memory device which communicates with an external host device allows a page of data to be re-written to a memory array from a page buffer. The host provides user data, a first write address and a write command to the memory device. If the write attempt fails, the host provides a re-write command with a new address, without re-sending the user data to the memory device. Additional data can be received at a data cache of the memory device while a re-write from the page buffer is in progress. The re-written data may be obtained in a copy operation in which the data is read out to the host, modified and written back to the memory device. Additional data can be input to the memory device during the copy operation. Page buffer data can also be modified in place.

Page buffer program command and methods to reprogram pages without re-inputting data to a memory device

A three-dimensional array of memory elements is formed across multiple layers of planes positioned at different distances above a semiconductor substrate. The memory elements reversibly change a level of electrical conductance in response to a voltage difference being applied across them. The three-dimensional array includes a two-dimensional array of pillar lines from the substrate through the multiple layers of planes. A first set of pillar lines acts as local bit lines for accessing the memory elements together with an array of word lines on each plane. A second set of pillar lines is connected to the word lines. An array of metal lines on the substrate is switchable connected to the pillar lines to provide access to the first and second sets of pillar lines, thereby to provide access respectively to the bit lines and word lines of the three-dimensional array.

Method for non-volatile memory having 3D array of read/write elements with efficient decoding of vertical bit lines and word lines

In some embodiments, a memory array is provided that includes (1) a first memory cell having (a) a first conductive line; (b) a first bipolar storage element formed above the first conductive line; and (c) a second conductive line formed above the first bipolar storage element; and (2) a second memory cell formed above the first memory cell and having (a) a second bipolar storage element formed above the second conductive line; and (b) a third conductive line formed above the second bipolar storage element. The first and second memory cells share the second conductive line; the first bipolar storage element has a first storage element polarity orientation within the first memory cell; the second bipolar storage element has a second storage element polarity orientation within the second memory cell; and the second storage element polarity orientation is opposite the first storage element polarity orientation. Numerous other aspects are provided.

Multi-level memory arrays with memory cells that employ bipolar storage elements and methods of forming the same

The system includes multiple sets of local data lines in one or more routing metal layers below the three-dimensional memory array and multiple sets of global data lines in one or more top metal layers above the three-dimensional memory array. Each set of one or more blocks include one set of the local data lines. Each bay includes one set of global data lines that connect to the group of sense amplifiers associated with the blocks of the respective bay. Each block includes a subset of first selection circuits for selectively coupling a subset of array lines of the first type to respective local data lines. Each block includes a subset of second selection circuits for selectively coupling a subset of the respective local data lines to global data lines associated with a respective bay.

Memory system with sectional data lines

A three-dimensional array is especially adapted for memory elements that reversibly change a level of electrical conductance in response to a voltage difference being applied across them. Memory elements are formed across a plurality of planes positioned different distances above a semiconductor substrate. A two-dimensional array of bit lines to which the memory elements of all planes are connected is oriented vertically from the substrate and through the plurality of planes. During sensing, to compensate for word line resistance, a sense amplifier references a stored reference value during sensing of a memory element at a given location of the word line. A layout with a row of sense amplifiers between two memory arrays is provided to facilitate the referencing. A selected memory element is reset without resetting neighboring ones when it is subject to a bias voltage under predetermined conditions.

Non-volatile memory having 3D array of read/write elements and read/write circuits and method thereof

A system connects a signal driver to a first control line that is connected to a first non-volatile storage element, charges the first control line while the signal driver is connected to the first control line, disconnects the signal driver from the first control line while the first control line remains charged from the signal driver, connects the signal driver to a second control line that is connected to a second non-volatile storage element, charges the second control line using the signal driver while the signal driver is connected to the second control line, and disconnects the signal driver from the second control line. The disconnecting of the signal driver from the first control line, the connecting the signal driver to the second control line and the charging of the second control line are performed without waiting for the first non-volatile storage element's program operation to complete.

Continuous programming of non-volatile memory

A storage system includes a three-dimensional memory array that has multiple layers of non-volatile storage elements grouped into blocks. Each block includes a subset of first selection circuits for selectively coupling a subset of array lines (e.g. bit lines) of a first type to respective local data lines. Each block includes a subset of second selection circuits for selectively coupling a subset of the respective local data lines to global data lines that are connected to control circuitry. To increase the performance of memory operations, the second selection circuits can change their selections independently of each other.

Memory system with data line switching scheme

A three-dimensional (3D) high density memory array includes multiple layers of segmented bit lines (i.e., sense lines) with segment switch devices within the memory array that connect the segments to global bit lines. The segment switch devices reside on one or more layers of the integrated circuit, preferably residing on each bit line layer. The global bit lines reside preferably on one layer below the memory array, but may reside on more than one layer. The bit line segments preferably share vertical connections to an associated global bit line. In certain EEPROM embodiments, the array includes multiple layers of segmented bit lines with segment connection switches on multiple layers and shared vertical connections to a global bit line layer. Such memory arrays may be realized with much less write-disturb effects for half selected memory cells, and may be realized with a much smaller block of cells to be erased.

Three-dimensional memory device incorporating segmented array line memory array

A three dimensional monolithic memory array of non-volatile storage elements includes a plurality of word lines and a plurality of bit lines. The plurality of bit lines are grouped into columns. One page of data is stored across multiple word lines by programming non-volatile storage elements connected to one column of bit lines and multiple word lines while maintaining the selection of the one column of bit lines. In one embodiment, programming non-volatile storage elements includes selectively connecting bit lines to sense amplifiers using selection circuits that include a storage device, a select circuit connected to the storage device and one or more level shifters providing two or more interfaces to the respective selection circuit.

Three dimensional memory system with page of data across word lines

Non-volatile memory having 3D array of read/write elements with efficient decoding of vertical bit lines and word lines

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San Jose, CA, United States of America

Luca Giovanni Fasoli