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Interuniversitair Micro-Elektronica Centrum Vzw

Luc Tielemans

Eric Beyne

Luc Irena De Schepper

Filip Christiaens

A method for evaluating the thermal impedance of packaged semiconductor chips. A measuring apparatus includes a thermostatic bath filled with a dielectric liquid and a temperature sensor for measuring the temperature of the bath. The semiconductor chip is subjected to a calibration step followed by a thermal response measurement step. Increasing the power pulse length allows measurement of the steady-state junction-to-case thermal resistance. The measuring apparatus and method is further used for tracing in-situ degradation of packaged semiconductor chips due to power cycling.

Method for thermal impedance evaluation of packaged semiconductor

A system for evaluating the thermal impedance of packaged semiconductor chips. The measuring apparatus includes a thermostatic bath filled with a dielectric liquid and a temperature sensor for measuring the temperature of the bath. The semiconductor chip is subjected to a calibration step followed by a thermal response measurement step. Increasing the power pulse length allows measurement of the steady-state junction-to-case thermal resistance. The measuring apparatus and method is further used for tracing in-situ degradation of packaged semiconductor chips due to power cycling.

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Simmerath, Germany

Luc Tielemans