International Business Machines Corporation

Other

Ciena Corporation

Ultratech, Inc.

Luc L Belanger

Paul Alfred Lauro

Da-Yuan Shih

Ajay Prabhakar Giri

John Ulrich Knickerbocker

Christian Lavoie

Stephen L Buchwalter

Sung Kwon Kang

Kamalesh K Srivastava

David Hirsch Danovitch

Donald W Henderson

Leena Paivikki Buchwalter

Jonathan H Griffith

Michael J Sullivan

Eric H Laine

Valérie Anne Oberson

Marc Adam Bergendahl

Valerie A Oberson

Raphael Beaupré-Laflamme

Simon-Pierre Pelletier

Robert Laforce

Éric Giguère

Patrice Arteau

Daniel Asselin

An apparatus for assembling a photonic system comprising a photonic integrated circuit (PIC) includes: a support structure configured to support the PIC; and a rigid structure surrounding a hollow passage that extends to an opening at a distal end of the rigid structure. The rigid structure includes an optically transmissive portion configured to transmit at least about 50% of a received beam of ultraviolet light, and configured such that at least a portion of the ultraviolet light transmitted through the rigid structure is incident upon an edge surface of the PIC at an angle of incidence that is less than about 60 degrees.

Managing adhesive curing for photonic system assembly

A light-emitting sign comprising a light source for emitting light, in which the light-emitting sign may be thin (e.g., comparable to a conventional non-light-emitting sign) while creating a desired visual effect using the light emitted by the light source. This may be achieved, for example, by the light source being thin itself and/or by having an external device connected to the light-emitting sign and implementing certain functionalities (e.g., powering and/or controlling the light source).

Light-emitting sign apparatus

An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting metallurgy including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.

Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers

Methods and UBM structures having bilayer or trilayer UBM layers that include a thin TiW adhesion layer and a thick Ni-based barrier layer thereover both deposited under sputtering operating conditions that provide the resultant bilayer or trilayer UBM layers with minimal composite stresses. The Ni-based barrier layer may be pure Ni or a Ni alloy. These UBM layers may be patterned to fabricate bilayer or trilayer UBM capture pads, followed by joining a lead-free solder thereto for providing lead-free solder joints that maintain reliability after multiple reflows. Optionally, the top layer of the trilayer UBM structures may include soluble or insoluble metals for doping the lead-free solder connections.

Structure of UBM and solder bumps and methods of fabrication

A method of implementing an injection molded soldering process for three-dimensional structures, particularly, such as directed to three-dimensional semiconductor chip stacking. Also provide is an arrangement for implementing the injection molded soldering (IMS) process. Pursuant to an embodiment of the invention, the joining of the semiconductor chip layers with a substrate is implemented, rather than by means of currently known wire bond stacking, through the intermediary of columns of solder material formed by the IMS process, thereby providing electrical advantages imparted by the flip chip interconnect structures. In this connection, various diversely dimensioned solder column interconnects allow for simple and dependable connections to a substrate by a plurality of superimposed layers or stacked arrays of semiconductor components, such as semiconductor chips. In accordance with a further aspect, it is possible to derive a unique design for an IMS mold structure, which contains cavities for forming the columnar fill of solder, and which also incorporates further cavities acting as cutouts for dies or the positioning of other electronic packages or modules.

Injection molded soldering process and arrangement for three-dimensional structures

Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers

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CA

Luc L Belanger