Bull Sas

Le Commissariat À L’énergie Atomique Et Aux Énergies Alternatives (cea)

Le Commissariat À L'énergie Atomique Et Aux Énergies Altervatives (cea)

Commissariat &#xc0; L'&#xc9;nergie Atomique Et Aux &#xc9;nergies Alternatives

Luc Dallaserra

Marc Raeth

Fabien Demange

Jithendra Bangera

Pascal Guilbault

An interlayer heat sink for a liquid cooling system for an electronic card, the interlayer heat sink including a cold inlet connector, a hot inlet connector, a hot outlet connector, and a cold outlet connector. An upper part of the cooling block divides the flow of heat transfer fluid entering through the cold inlet connector into a first flow, which is oriented towards the lower part of the cooling block so as to collect heat generated by the electronic card by being conveyed to the hot outlet connector, and a second flow, oriented directly to the cold outlet connector, to convey the flow of heated-up heat transfer fluid received on the hot inlet connector directly to the hot outlet connector where it fuses with the heated-up flow in the lower part of the cooling block.

Interlayer heat sink for cooling system of an electronic card of a supercomputer

An inlet heat sink for a liquid cooling system of an electronic board, including a cold inlet connector, a hot outlet connector, and a cold outlet connector. An upper part of a cooling block being configured to divide a flow of incoming heat transfer fluid by the cold inlet connector into a first flow oriented to collect the heat generated by the electronic board by being routed to the hot outlet connector, and a second flow, oriented directly to the cold outlet connector.

Inlet heat sink for a cooling system of a supercomputer electronic board

An outlet heat sink for a liquid cooling system for an electronic board, including a cold inlet connector, a hot inlet connector and a hot outlet connector. An upper part of a cooling block, on the one hand, conveys the flow of heat transfer fluid entering through the cold inlet connector to the lower part of the cooling block so as to collect heat generated by the electronic board by being conveyed to the hot outlet connector, and on the other hand, conveys the flow of heated-up heat transfer fluid received on the hot inlet connector directly to the hot outlet connector.

Outlet heat sink for cooling system of a supercomputer electronic board

Disclosed is a system and a method for connecting at least one electronic card to an electronic board of a computer device, the system including an electronic board, equipped with a plurality of connectors for connecting at least one electronic cards to the electronic board, and slots for connecting at least one component to the electronic board. The at least one electronic card are substantially perpendicular to the electronic board. The system further includes a first supporting means being configured such that the at least one electronic card is first mounted onto the first support before the first support is placed above the electronic board in the vertical direction. The system further includes a second support installed underneath the electronic board in the vertical direction. The system includes further ejection mechanism and insertion mechanism. The system for connecting may include a plurality of electronic boards.

System and method for connecting at least one electronic card to a printed circuit board

A dissipating interconnection module for an M.2 form factor expansion card, includes a heat sink, which includes an enclosure including an upper wall for being in thermal contact with the first heat exchange surface of the expansion card and two tabs, each tab for being in thermal contact with the upper wall of the heat sink and for being in thermal contact with the fluid cooling system of the first electronic board, and the upper wall and the two tabs of the enclosure being arranged to form a space in which the expansion card can be received; a mechanical attachment system for removably mechanically attaching the expansion card to the heat sink; an interconnection electronic board including the second M.2 connector, a third electrical connector to be connected to a fourth electrical connector of the first electronic board.

Dissipating interconnection module for M.2 form factor expansion card

A heatsink for a plurality of memory modules that can be connected to an electronic board, each memory module including two heat exchange surfaces, includes at least one envelope including a top surface, at least two outer tabs, configured to be in thermal contact with at least one heat exchange surface of at least one memory module, at least one contact surface, in thermal contact with the fluid cooling system of said electronic board, a plurality of inner tabs, each inner tab being interposed between two memory modules in order to make thermal contact with at least one exchange surface of each of the two memory modules, the envelope is detachably placed against the two exchange surfaces of each memory module, the envelope is mechanically detachably fastened to the board.

Heatsink for multiple memory modules

A device for spreading the floor-loading of a computer cabinet includes a bottom, an external face of which is to be positioned facing the floor. The external face of the bottom of the cabinet includes pins, each pin including at its end furthest from the bottom a head the diameter of which is greater than the diameter of a shank of the pin, the shank providing the connection between the cabinet and the pin, the load-spreading device includes at least two beams, each beam including at least two parallel flat faces: a first face includes a slot acting as a rail, the width of the slot being greater than the diameter of a pin shank but less than the diameter of a pin head, this slot collaborating with at least two pins for the installation of the beam, a second face is in contact with the floor.

Floor-loading load-spreading system for computer cabinet

An electronic board includes a support on which first electronic components are installed, the first electronic components having a height of less than a first threshold height h; a cold plate that extends parallel to the support, the distance between the cold plate and the support being equal to the first threshold height h, the cold plate including a base plate in which at least one channel is formed through which a coolant can circulate, the base plate being fixed to a complementary plate closing the channel, the cold plate covers all first electronic components, the first electronic components being connected to the cold plate through deformable pads made of a heat conducting material.

Growing community of inventors

Paris, France

Luc Dallaserra