Western Digital (fremont), Inc.

Headway Technologies, Incorporated

Luc Chung

Steven C Rudy

Lei Wang

Nurul Amin

Shaoping Li

Xuhui Jin

Christopher L Beaudry

Mark David Thomas

Weihao Xu

Matteo Staffaroni

Peng Luo

Neil David Knutson

Lei Zhang

Yingbo Zhang

Jimmy J Shen

Guolun Hao

A thermally assisted magnetic recording head is disclosed with a light delivery waveguide circuit wherein a middle section of the primary waveguide (WG) has a curved portion. In one embodiment, the curved portion connects to a front WG section at the air bearing surface (ABS) and is offset in a cross-track direction from the laser diode to prevent stray light from heating metal parts proximate to the front section and undesirable writer protrusion. Optionally, a reflective blocker is inserted between the WG spot size converter and ABS. In a second embodiment, the laser diode, spot size converter, and front WG section are all aligned along a center slider plane. The curved portion has at least one 180&#xb0; bend to bend light around the blocker that is between the spot size converter and WG front section. The blocker is tilted to prevent reflected light from returning to the laser diode.

Thermal assisted magnetic recording light delivery waveguide circuit for reduced stray light induced writer protrusion

Systems and methods for using NFT disc test structures for controlling NFT disc length during manufacture of an HAMR writer are disclosed. An NFT is manufactured concurrently with one or more pairs of pin-disc and disc-less test structures. The NFT disc and pin dimensions may be substantially similar to the pin and disc dimensions of the pin-disc test structure. The disc length of the pin-disc test structure is measured as a function of the difference in resistance between the two test structures and other parameters. Capturing the disc length variation subsequently enables adjustment of the NFT electronic lapping guide stripe height to reduce length variation in the NFT pin.

Test structures for measuring near field transducer disc length

A method of making a magnetic head is provided. The method includes forming a first read sensor and a first electrical contact formed with a first shunt region. The method further includes forming a first mid-shield layer on the first read sensor, the first mid-shield layer being electrically connected to the first electrical contact. Additionally the method also includes forming a second mid-shield layer over the first mid-shield layer. Further, the method also includes forming a second read sensor over the second mid-shield layer, the second read sensor having a second electrical contact formed with a second shunt region electrically connected to the first shunt region.

Apparatus and method having TDMR reader to reader shunts

A slider bar apparatus, and a method for lapping a back side surface of the slider bar, is provided. The slider bar includes a head part and a pair of sliders separated by the head part. Each of the sliders has an air bearing surface (ABS) and a back side surface opposite the ABS. Each of the sliders has a reader element and a writer element of a magnetic head for use in a magnetic hard disk drive. An electrical lapping guide is mounted on the back side surface and has a pair of terminals and a conductive material extending between the terminals. The conductive material is arranged on the slider bar such that the resistance between the terminals increases during a lapping of the back side of the sliders.

Electrical lapping guide for dimensional control of back side of heat assisted magnetic recording device

A method for bonding a first substrate to a second substrate is described. The first substrate includes a first plurality of solder pads, a first alignment mark set, and a first plurality of dots. The second substrate includes a second plurality of solder pads, a second alignment mark set, and a second plurality of dots configured to interlock with the first plurality of dots. The method includes aligning the first alignment mark set with the second alignment mark set. The first alignment mark sets being aligned corresponds to the dots and the solder pads being aligned. The method also includes locking the first plurality of dots with the second plurality of dots to form an interlocking key. The method also includes reflowing at least one of the first and second pluralities of solder pads. The dots remain substantially solid during the reflow.

Method for bonding substrates in an energy assisted magnetic recording head

A system for performing bonding of a first substrate including a first plurality of solder pads to a second substrate including a second plurality of solder pads comprises a first alignment mark set and a first plurality of dots on the first substrate. The system further comprises a second alignment mark set and a second plurality of dots on the second substrate. The second plurality of dots are configured to interlock and form an interlocking key with the first plurality of dots. The first alignment mark set is aligned with the second alignment mark set corresponding to the first and second plurality of dots being aligned and the first and second plurality of solder pads being aligned. The first and second plurality of dots are configured to remain substantially solid during a reflow of the first plurality of solder pads.

System for performing bonding a first substrate to a second substrate

A recording head comprises a write element, including a coil and a dynamic fly-height heater, and two electrical lapping guides. The head also comprises a number of bonding pads including a DFH bonding pad and a shared bonding pad both electrically connected to the dynamic fly-height heater. Each lapping guide defines a circuit between the shared bonding pad and a dedicated bonding pad and each includes a resistive element. The resistive elements of the two lapping guides can be vertically aligned to be used to control a lapping tilt angle when a bar of unfinished heads is lapped. After lapping, a channel is defined into the transducer of the recording head. Forming the channel can remove at least a portion of each lapping guide in order to break the electrical circuit of that guide.

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Fremont, CA, United States of America

Luc Chung