Siemens Aktiengesellschaft

Siemens Production & Logistics Systems Ag

Michael Huber Gmbh

Luc Boone

Marc De Vogelaere

Hubert De Steur

Ferdinand Quella

Daniel Hosten

Jacky Vanhumbeeck

Antoon Mattelin

Jozef Van Puymbroeck

Laurent Danneels

Hans-Fr Schmidt

Sybille Von Tomkewitsch

Wilfried Denys

Karl H Houska

Lothar Floegel

Marcel Heermann

Frank Vangaever

Luc Demaegd

Juergen Frankel

Pol Pecceu

Joachim Hauck

The parts are produced by two-component injection molding. Those regions that are to be metallized consist of a first plastic and those regions that are not to be metallized consist of a second plastic. After the entire surface of the parts has been seeded, the seeding is selectively removed with the aid of a solvent in the regions which are not to be metallized. The first plastic is insoluble and the second plastic soluble in the solvent. The selective metallization then takes place by electroless metal deposition and, if appropriate, electrodeposition of metal.

Process for producing three-dimensional, selectively metallized parts

The invention relates to a method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections. The substrate (S ) is given a slanted, roof-shaped or convex contour (K ) in the area of at least one front face and/or in the area of at least one inner wall of a recess. After metallizing the substrate (S ), printed-board conductor-shaped cross connections (Q) are produced in the area of the above-mentioned contours (K ) simultaneously with laser structuring of printed board conductors (L) on the top part (0) and the bottom part (U) of the substrate (S ).

Wiring arrangements having electrically conductive cross connections and method for producing same

A method and coating material for applying electrically conductive printed patterns to insulating substrates is provided. The coating material includes a non-metallic, grainy carrier substance having metal of the oxidation degree 0 applied thereto. An energy radiation source, particularly of a deflectable laser beam, is used to secure anchoring of the carrier substance to the substrate in the region of the desired printed pattern. As a consequence of a three-dimensional arrangement of the metal, a three-dimensional nuclei distribution is produced that leads to a reliable and fast metallization of the printed pattern on the basis of chemical metal deposition. The method of the invention is especially suited for laser pattern transfer for the manufacture of printed circuit boards.

Method and coating material for applying electrically conductive printed

An additive-free, fast-precipitating electrolyte bath for precipitating lustrous, crack-free palladium layers on workpieces is formulated, by successively adding to distilled water heated up to about 90.degree. C., phosphoric acid, sufficient ammonia to neutralize the phosphoric acid and palladium, in the form of palladium chloride. After dissolution of the palladium salt, the operating pH value is adjusted by additions of ammonia or phosphoric acid as required and the volume of the bath can be increased as desired by additions of further distilled water. The bath can be filtered prior to use.

Additive-free, fast precipitating palladium electrolyte bath and process

An electrolysis device for electrolytic deposition of a metal on at least one surface of the tape which has been precoated with a metal provides an electrolytic metal deposition band in which there is a first electrode for connection to a first voltage source. A tape drive is provided for moving the tape through the bath including first guide rollers defining a single loop for the tape through the bath. A second electrode is provided in the tape path and mounted to contact the tape above the entrance to the bath and over an area of the one metallized surface and is connected to a second source potential. Second guide rollers along the tape path downstream of the bath, including a second guide roller contact the metallized surface and is connected to a third source potential.

Electrolysis device for the galvanic reinforcement of tape-shaped

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Oostkamp, Belgium

Luc Boone