Advanced Semiconductor Engineering, Inc.

Lu-Ming Lai

Hsun-Wei Chan

Ying-Chung Chen

Ching-Han Huang

Chi Sheng Tseng

Shih-Chieh Tang

Hui-Chung Liu

Hsin-Ying Ho

Yu-Hsuan Tsai

Kuang-Hsiung Chen

Yu-Che Huang

Kuo-Hua Lai

Yu-Ying Lee

Mei-Yi Wu

Cheng-Ling Huang

Wei-Wei Liu

Huei-Siang Wong

Yung-Yi Chang

Hsu-Liang Hsiao

Hsin Lin Wu

Chia-Hung Shen

Yi Wen Chiang

Ying-Te Ou

Chang Chin Tsai

Chin-Cheng Kuo

Chia Yun Hsu

Hsiang-Cheng Tsai

I Hung Wu

Yu-Min Peng

Ruei-Bin Ma

Chien-Wei Fang

Kai-Sheng Pai

Yin-Hao Chen

San-Kuei Yu

Tsann Huei Lee

Pu Shan Huang

An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

Optical module and method of making the same

The present disclosure provides a body-part tracking device and a body-part tracking method. The body-part tracking device includes a first electronic component and a first antenna element. The first antenna element is electrically connected to the first electronic component and configured to receive a first wave. The first electronic component is configured to, in response to the first wave, transmit a second wave.

Body-part tracking device and body-part tracking method

The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

Electronic package structure

At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.

Semiconductor device package and a method of manufacturing the same

The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.

Optical module

A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a sensor module, a connector, and a stress buffer structure. The sensor module is disposed on the carrier. The connector is connected to the carrier. The stress buffer structure connects the connector to the sensor module.

Semiconductor device package

A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a sensor, an optical component and a fixing element. The optical component directly contacts the sensor. An interfacial area is defined by a contacting region of the optical component and the sensor. The fixing element is disposed outside of the interfacial area for bonding the optical component and the sensor.

Optical package structure

A semiconductor device package includes a light-emitting device, a diffuser structure, a first optical sensor, and a second optical sensor. The light-emitting device has a light-emitting surface. The diffuser structure is above the light-emitting surface of the light-emitting device. The first optical sensor is disposed below the diffuser structure, and the first optical sensor is configured to detect a first reflected light reflected by the diffuser structure. The second optical sensor is disposed below the diffuser structure, and the second optical sensor is configured to detect a second reflected light reflected by the diffuser structure.

Semiconductor package structure and method of manufacturing the same

A semiconductor package structure includes a die paddle, a plurality of leads, an electronic component and a package body. Each of the plurality of leads is separated from the die paddle and has an inner side surface facing the die paddle. The electronic component is disposed on the die paddle. The package body covers the die paddle, the plurality of leads and the electronic component. The package body is in direct contact with a bottom surface of the die paddle and the inner side surface of the plurality of leads.

Semiconductor package structures and methods of manufacturing the same

A semiconductor device package and a method for packaging the same are provided. A semiconductor device package includes a carrier, an electronic component, a buffer layer, a reinforced structure, and an encapsulant. The electronic component is disposed over the carrier and has an active area. The buffer layer is disposed on the active area of the electronic component. The reinforced structure is disposed on the buffer layer. The encapsulant encapsulates the carrier, the electronic component and the reinforced structure.

Semiconductor device package including reinforced structure

A semiconductor package structure includes an electronic device having a first surface and an exposed region adjacent to the first surface; a dam disposed on the first surface and surrounding the exposed region of the electronic device; and a filter structure disposed on the dam.

Semiconductor package structure and method for manufacturing the same

A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a semiconductor package device, a first constraint structure and a second constraint structure. The first constraint structure is connected to the semiconductor package device. The second constraint structure is connected to the semiconductor package device and under a projection of the semiconductor package device.

Growing community of inventors

Kaohsiung, Taiwan

Lu-Ming Lai