Lucent Technologies Inc.

Lu Fang

Frederick Arthur Yeagle

Brian Dale Potteiger

Dominic Paul Rinaudo

Frederick W Warning, Jr

Shaun P Scrak

Brian Dale Pottelger

A method for providing fluxless soldering without oxide formation includes mounting a component on a pedestal of a base. A housing is also mounted on the base, the housing and the base together define a closed cavity containing the component. An inert gas is introduced into the cavity to create an inert gas-rich environment. Thereafter, the cavity is heated sufficiently to reflow solder provided between the component and the housing, to join the component to the housing without the formation of additional oxides on the solder joint.

Direct-placement fluxless soldering using inert gas environment

An apparatus for performing fluxless soldering includes an enclosure having a gas inlet through which an inert gas is introduced to create an inert gas-rich environment. Components are placed in the enclosure via an access port which also functions as a vent for allowing purge gases to vent from the enclosure. In one embodiment, a heating stage is provided in the enclosure which provides sufficient heat to reflow solder provided between two or more components. The inert gas is constantly flowing, or purging the enclosure in order to displace oxygen that would initially be present in the system. The presence of inert gas exclusive of other materials provides an oxygen-free environment, i.e., the inert gases provide a &ldquo;shield&rdquo; or environment around the parts to be soldered to inhibit the formation of additional oxides during soldering. The apparatus may also include an optics holder for transmitting light from an external light source into the enclosure, to permit visual alignment of component parts.

Automated fluxless soldering using inert gas

System for providing back-lighting of components during fluxless soldering

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Whitehall, PA, United States of America

Lu Fang