Winbond Electronics Corporation

Kla Tencor Corporation

Hon Hai Precision Industry Co., Ltd.

Tsinghua University

Boe Technology Group Co., Ltd.

Beijing Boe Sensor Technology Co., Ltd.

Beijing Beifen-ruili Analytical Instrument (group) Co., Ltd.

Maituowei Precision Instrument Manufacturing Hebei Co., Ltd.

Lu Chen

Bingxue Shi

Chun Lu

Lisheng Gao

Lin Zhu

Wen-Zhen Li

Yuan-Feng Liu

Ze-Cheng Hou

Richard Wallingford

Mohan Mahadevan

Tao Luo

Jason Kirkwood

James A Smith

Junqing (Jenny) Huang

Wei Zhao

Yiming Wang

Xiaoqiang Yang

Robert M Danen

Cuiwei Tang

Zhifeng Zhang

Grace H Chen

Rudolf C Brunner

Zixiang Lin

Jian Li

Chuncheng Che

Qiang Q Zhang

Chun Hsien Lu

Mengjiao Li

Jiaxiang Deng

Rongbing Tian

Sainan Li

Jinrong Liu

Hongxiang Shu

Chen Luan

Provided is a dual-polarized antenna. The dual-polarized antenna includes: a radiation structure, a first feeder, a second feeder, a first phase-shifting structure, a second phase-shifting structure, and a third phase-shifting structure, wherein the first phase-shifting structure is electrically connected to the radiation structure via the first feeder, the second phase-shifting structure is electrically connected to the radiation structure via the second feeder, and a feed direction of the first feeder is different from a feed direction of the second feeder; and the first phase-shifting structure and the second phase-shifting structure both are electrically connected to the third phase-shifting structure and both are disposed on different layers with the third phase-shifting structure, and a maximum phase-shifting degree of the first phase-shifting structure and a maximum phase-shifting degree of the second phase-shifting structure both are less than a maximum phase-shifting degree of the third phase-shifting structure.

Dual-polarized antenna and electronic device

A dual-frequency antenna and an electronic device are provided, and belong to the field of communication technology. The dual-frequency antenna includes a first antenna unit and a second antenna unit opposite to each other, and a filtering unit therebetween. An operating frequency band of the first antenna unit is a first frequency band; an operating frequency band of the second antenna unit is a second frequency band; the filtering unit is configured to reflect an electromagnetic wave of the first frequency band and to transmit an electromagnetic wave of the second frequency band; the first antenna unit is configured to receive the electromagnetic wave of the first frequency band and to reflect the received electromagnetic wave of the first frequency band by the filtering unit; and the second antenna unit is configured to receive and reflect the electromagnetic wave of the second frequency band transmitted by the filtering unit.

Dual-frequency antenna and electronic device

Provided are an antenna structure, an array antenna and an electronic device. The antenna structure includes a first substrate, a second substrate and a dielectric layer with an adjustable dielectric constant. The first substrate includes a first base and a first and a second radiation phase shift unit. The second substrate includes a second base and a third and a fourth radiation phase shift unit. Orthographic projections of the first and third radiation phase shift units on the first base at least partially overlap. Orthographic projections of the second and fourth radiation phase shift units on the first base at least partially overlap. A first included angle is formed between extending directions of radiation areas of the first and second radiation phase shift units; a second included angle is formed between extending directions of radiation areas of the third and fourth radiation phase shift units.

Antenna structure, array antenna and electronic device

A method for making a three-dimensional hierarchical layered porous copper, the method includes providing a copper-zinc alloy precursor being composed of a &#x3b2;' phase and a &#x3b3; phase, and treating the copper-zinc alloy precursor by electrochemical dealloying. The present application further provides a three-dimensional hierarchical layered porous copper including a first surface layer, an intermediate layer, and a second surface layer stacked in that order. The first surface layer includes a plurality of micron-scale pores and a plurality of first nanoscale pores. The intermediate layer includes a plurality of second nanoscale pores. The second surface layer includes the plurality of micron-scale pores and the plurality of first nanoscale pores.

Three-dimensional hierarchical layered porous copper and method for making the same

A method for forming a current collector is provided. At least two carbon nanostructure reinforced copper composite substrates are provided. The at least two carbon nanostructure reinforced copper composite substrates are stacked to form a composite substrate. An active metal layer is disposed on a surface of the composite substrate to form a first a composite structure. The first composite structure is pressed to form a second composite structure. The second composite structure is annealed to form a third composite structure. The third composite structure is de-alloyed to form a porous copper composite.

Current collector and anode electrode of lithium ion battery, and method for fabricating the same

A piston-cylinder structure includes a cylinder, an end cap, a tapered portion for extruding dead space, an upper bowl-shaped seal portion, a columnar seal portion, a lower bowl-shaped seal portion and a piston push rod. The upper bowl-shaped seal portion is configured to form sealing between the piston push rod and the cylinder when the piston push rod moves toward the end cap and to remove crystals on an inner wall of the cylinder. The columnar seal portion is configured to enable the piston push rod to be coaxial with the cylinder, and to provide a mechanical support for the piston push rod. The lower bowl-shaped seal portion is configured to provide sealing between the piston push rod and the cylinder and remove the crystals on the inner wall of the cylinder when the piston push rod moves toward the end cap.

Piston seal structure for injector

An aluminum matrix composite is provided. The aluminum matrix composite comprises at least one reinforcement layer and an aluminum layer. The at least one reinforcement layer comprises a plurality of reinforcement sheets. The plurality of reinforcement sheets are uniformly dispersed in at least a portion of the aluminum layer.

Aluminum matrix composites and method thereof

A method for forming a porous copper composite is provided. At least two carbon nanostructure reinforced copper composite substrates are provided. The at least two carbon nanostructure reinforced copper composite substrates are stacked to form a composite substrate. An active metal layer is disposed on a surface of the composite substrate to form a first a composite structure. The first composite structure is pressed to form a second composite structure. The second composite structure is annealed to form a third composite structure. The third composite structure is de-alloyed to form a porous copper composite.

Porous copper composite and method thereof

An anode of the lithium ion battery is provided. The anode of the lithium ion battery comprises a nanoporous copper substrate and a copper oxide nanosheet array. The copper oxide nanosheet array is disposed on one surface of the nanoporous copper substrate, and the nanoporous copper substrate is chemically bonded to the copper oxide nanosheet array.

Anode of lithium battery, method for fabricating the same, and lithium battery using the same

A method for forming an aluminum matrix composite is provided. At least one reinforcement layer and an aluminum layer are provided. The at least one reinforcement layer is disposed on at least one surface of the aluminum layer to form a first composite structure. The first composite structure is pressed to form a second composite structure. A process of alternatively folding and pressing the second composite structure is repeated to form the aluminum matrix composite.

Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second image data for the wafer using the output generated using the second optical state. In addition, the method includes combining the first image data and the second image data corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer. The method further includes detecting defects on the wafer using the additional image data.

Systems and methods for detecting defects on a wafer

In an optical inspection tool, an illumination aperture is opened at each of a plurality of aperture positions of an illumination pupil area one at a time across the illumination pupil area. For each aperture opening position, an incident beam is directed towards the illumination pupil area so as to selectively pass a corresponding ray bundle of the illumination beam at a corresponding set of one or more incident angles towards the sample and an output beam, which is emitted from the sample in response to the corresponding ray bundle of the incident beam impinging on the sample at the corresponding set of one or more incident angles, is detected. A defect detection characteristic for each aperture position is determined based on the output beam detected for each aperture position. An optimum aperture configuration is determined based on the determined defect detection characteristic for each aperture position.

Wafer and reticle inspection systems and methods for selecting illumination pupil configurations

Systems and methods for detecting defects on a wafer are provided. One method includes combining first image data and second image data, generated using different output generated using different values for focus of an inspection system, corresponding to substantially the same locations on the wafer thereby creating additional image data for the wafer and detecting defects on the wafer using the additional image data.

Detecting defects on a wafer

Growing community of inventors

Beijing, China

Lu Chen