Ceridian Corporation

General Dynamics Information Systems, Inc.

Ceridan Corporation

Lowell Dennis Lund

Deepak Keshav Pai

Gene A Maday

Leo Marvin Rosenstein

An interposer is formed by forming a laminate comprising a first sheet of electrically insulating material and a second sheet of conductive material. The first sheet has a first plurality of apertures therethrough and the second sheet is laminated to the first sheet to close the first plurality of apertures. Material is removed from the second sheet around the first plurality of apertures to form conductive pads, the pads closing the first plurality of apertures. A third sheet of electrically insulating material is attached to the second sheet. The third sheet has a second plurality of apertures therethrough, the third sheet being positioned relative to the second sheet such that the apertures of the second plurality are closed by the conductive pads. In a preferred form, the third sheet is positioned relative to the first sheet so that the apertures of the second plurality are not in registration with the apertures of the first plurality.

Process of making interposers for land grip arrays

A system for removing solder from an area grid array pad by applying a wire mesh to a conductive surface of the area grid array that is covered with solder. Heat is applied to the wire mesh and the conductive surface of the area grid array so that the solder flows from the conductive surface onto the wire mesh. The wire mesh is removed from the conductive surface thereby removing all solder from the conductive surface of the area grid array.

Method and apparatus to wick solder from conductive surfaces

A method of combining a metal component and a base metal of an article to form a pattern of the article. The method comprises applying the metal component to a carrier, the metal component shaped like the pattern; placing the metal component against the base metal; and supplying heat such that the base metal and the metal component alloy.

Mark of an electronic component lid

The present invention is an integrated heat sink module and a method of fabricating conductive structures on a substrate. The method of the present invention includes cleaning a substrate material to remove any impurities present on the substrate surface. The method further includes placing a protective layer resilient to chemicals used in conductive structure formation, on a first surface. The first surface is opposite a second surface on which conductive structures are formed. The method includes forming conductive structures on the second surface of the substrate. The protective layer is then removed from the first surface of the substrate.

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Eden Prairie, MN, United States of America

Lowell Dennis Lund