Convex Computer Corporation

Louis W McEwin, Jr

Shun-lung Chao

A heat transfer assembly 11 is disclosed for transferring heat from a heat generating electronic device 15 or computer chip to ambient air. The heat transfer assembly 11 is comprised of a heat pipe 20 mounted perpendicular to a heat generating electronic device 15. The heat transfer assembly 11 is designed to provide a mechanically solid support for the bonding of the various heat transfer assembly components and to use circumferentially mounted fins 23 to increase the efficiency of heat transfer away from the electronic devices 15. The heat transfer assembly can function effectively when mounted in any direction. Thermocouples 42 are used to monitor the temperature and efficiency of the heat generating electronic device 15 such that corrective action can be initiated if the device begins to overheat.

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Plano, TX, United States of America

Louis W McEwin, Jr