Lucent Technologies Inc.

Louis T Gomez

Mark Anthony Cappuzzo

Joseph Shmulovich

Christopher Richard Doerr

John VanAtta Gates

Dirk Joachim Muehlner

Ho Bun Chan

Gerard Edmond Henein

Martin Haueis

Louis Nelson Ahlquist

Isaac Ryazansky

John Van Atta Gates, Ii

James F Bailey

Judith Martin Szalkowski

Materials such as titanium are vapor-deposited in the presence of, e.g., oxygen to form a film on a substrate, such as to provide an adhesion layer between a silicon movable structure in an optical MEMS device and a gold layer serving as a reflecting surface. The resulting film contains titanium and oxygen. Varying the conditions under which the film is deposited varies the intrinsic stress of the film, which varies the change in substrate shape caused by the presence of the film. A film having a desired intrinsic stress may be obtained by control of the oxygen partial pressure when the film is deposited. In one embodiment, the oxygen partial pressure in the atmosphere present during titanium deposition is greater than about 2&#xd7;10Torr, and preferably between about 1&#xd7;10Torr and about 2&#xd7;10Torr.

Control of stress in metal films by controlling the atmosphere during film deposition

A compact laser package having a submount with a plurality of electrical contact pads and a plurality of electrical connection lines formed thereon. The submount may be configured to receive at least one optical component thereon, the at least one optical component being in electrical communication with at least one of the plurality of electrical connection lines. A lid is provided, the lid having a recessed portion and a groove formed therein, the recessed portion being positioned in an interior of the lid and the groove being positioned to intersect the recessed portion and a peripheral edge of the lid. The submount is generally configured to cooperatively engage the lid to form a hermetically sealed laser package.

Laser package

The specification describes thermo-optically controlled waveguides where the thermo-optic control is a heater strip precisely aligned to the waveguide core by using the heater strip as an etch mask to define at least part of the core/upper cladding structure. In one embodiment the heater strip mask is larger than the underlying waveguide core so as to produce, on etching, a core surrounded with a minimum of cladding material on the sidewalls of the core, and a confined heat channel between the waveguide core and the heater strip. In a second embodiment the heater strip is used as an etch mask to define a core cladding stack, and a third cladding layer is deposited to clad the sidewalls of the core. In this embodiment, the cladding material in the stack can be optimized for thermal conductivity, and the third cladding material can be optimized for thermo-optic sensitivity.

Tunable optical waveguides

The specification describes wafer fabrication cleaning processes for silicon optical bench technology. The cleaning processes are designed to remove debris in situ after dicing silicon wafers mounted on a tape carrier. They were also developed specifically to avoid staining and residues that often result from using standard dicing approaches in silicon optical bench integrated circuit manufacture.

Process for the manufacture of optical integrated circuits

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North Plainfield, NJ, United States of America

Louis T Gomez