Future Automation, Inc.

Louis J Hirbour

Heinz W Schlenker

Daniel J Gramarossa

Earl J Fadgen, Jr

A process and solution is disclosed for removing resin bleed from leads of an encapsulated electronic component in which the component is positioned in an aqueous bath having dissolved therein glycerol and a phosphate salt selected from the group consisting of an alkali metal or ammonium phosphate, polyphosphate or pyrophosphate salt. The component is cathodically connected in an electric circuit enabling electrical current to pass through said component.

Process and solutions for removing resin bleed from electronic components

Disclosed is an in-line electrolytic deflash system and method for removing resin bleed and other materials from the leads of an encapsulated electronic component. An encapsulated electronic component is carried on a continuous belt through the system. The component first passes through an electrolytic deflash station which includes tanks filled with a deflash solution for loosening the resin bleed. The component is then rinsed in a low pressure rinse station, and then carried through a high pressure rinse station where the loosened resin bleed is removed from the component. The component is then further rinsed with both tap water and a deionized water. Once the component has been sufficiently rinsed any remaining moisture is blown off the part in an air knife station and the component is then passed through a dryer which completely removes any moisture remaining on the component.

Growing community of inventors

Yorba Linda, CA, United States of America

Louis J Hirbour