Vlsi Technology, Inc.

Angstrom Technologies, Inc.

Other

Louis H Liang

Daniel A Marinello

William J Ryan

Donald Lee Wray

Sang S Lee

Tsing-Chow Wang

Jon M Long

Young I Kwon

William G McGinness

David Silverglate

A system ( ) is provided for performing first order authentication of articles marked with indicia ( ) discernible in visible, ultraviolet, or infrared light or tagged with UV- or IR-sensitive chemicals. The first-order authentication system provides reliable visual authentication by providing for juxtaposition of the article-under-test ( ) with a known reference-standard sample-specimen ( , or ), while the article-under-test ( ) is illuminated by a suitable source ( or ) of radiation in the visible, ultraviolet, or infrared portions of the electromagnetic spectrum. Thus, the system ( ) facilitates comparison to differentiate a genuine article from a counterfeit article with first-order accuracy but at a substantially lower cost than that of automated authentication systems. Additionally, the system can be used in both portable and desk top embodiments. The system preferably has optional interchangeable holders ( or ) for various articles-under-test as well as an optional interchangeable holder ( ) for various reference-standard sample-specimens. Some embodiments utilize structures incorporating split-image optics ( ), superposed-image optics, and/or a blink-comparator.

First-order authentication system

An authentication system combines a source of ultraviolet light (and optionally a scanning mechanism) with apparatus for capturing and recognizing either graphic images or characters or both, where the graphic images and/or characters have been previously made with fluorescent substances that may be invisible under ordinary visible light, but are rendered detectable by the ultraviolet light. As in conventional optical character recognition (OCR), the characters may be conventional alphanumeric characters readable by human readers once they are made visible. The authentication system has a housing enclosing its optical path, a source of UV light, a detector for detecting graphic images or characters, conversion of the detector signal to digital form, a memory storing predetermined indicia, recognition logic, and indicating means. The system may also include a scanning mechanism and optical filters to select predetermined wavelengths of fluorescent light. The detector may be capable of detecting both fluorescent images and normal visible images, and the authentication system may incorporate switching mechanisms to allow multiplexed acquisition of fluorescent and normally visible images. The authentication system can operate in conjunction with a process for marking articles with indicia selected from a predetermined set of graphic images and characters readable by optical character recognition and/or by image comparison. That process can include printing fluorescent graphic images or characters in registration with (or with predetermined offset from) visible images or characters or indicia printed with substances fluorescent at different wavelengths. The recognition logic of the authentication system can include comparison of fluorescent and visible images or two different fluorescent images with each other. Pairs of indicia to be recognized and/or compared may be arranged to constitute a stereogram or other arrangement for first-order authentication by a human observer.

Apparatus and methods for authentication using partially fluorescent graphic images and OCR characters

Money checker

A method and apparatus for a reinforced leadframe to substrate attachment in a semiconductor assembly. In one embodiment, a printed circuit board having a plurality of electrically coupled electrical contact regions and wire bond areas formed thereon has a leadframe attached thereto such that each of the bonding fingers of the leadframe is coupled to a respective electrical contact region on the printed circuit board. A ribbon of B-staged epoxy is disposed on the leadframe such that said leadframe is disposed between the ribbon of B-staged epoxy and the printed circuit board. An integrated-circuit die is mounted on the printed circuit board with the bonding fingers of the leadframe peripherally surrounding the integrated circuit die. The bonding pads on the integrated-circuit die are electrically coupled to respective wire bond areas on the printed circuit board. By placing the ribbon of B-staged epoxy over the leadframe, the connection between each bonding finger of the leadframe and the respective electrical contact region is reinforced. Thus, the present claimed invention reduces separation between each bonding finger of the leadframe and the respective electrical contact region of the printed circuit board thereby providing improved reliability and yield in such semiconductor assemblies.

Reinforced leadframe to substrate attachment

A method and apparatus for a reinforced leadframe to substrate attachment in a semiconductor assembly. In one embodiment, a printed circuit board having a plurality of electrically coupled electrical contact regions and wire bond areas formed thereon has a leadframe attached thereto such that each of the bonding fingers of the leadframe is coupled to a respective electrical contact region on the printed circuit board. A ribbon of B-staged epoxy is disposed on the leadframe such that the leadframe is disposed between the ribbon of B-staged epoxy and the printed circuit board. An integrated-circuit die is mounted on the printed circuit board with the bonding fingers of the leadframe peripherally surrounding the integrated circuit die. The bonding pads on the integrated-circuit die are electrically coupled to respective wire bond areas on the printed circuit board. By placing the ribbon of B-staged epoxy over the leadframe, the connection between each bonding finger of the leadframe and the respective electrical contact region is reinforced. Thus, the present claimed invention reduces separation between each bonding finger of the leadframe and the respective electrical contact region of the printed circuit board thereby providing improved reliability and yield in such semiconductor assemblies.

Apparatus and methods for fluorescent imaging and optical character

An improved laser printer or photocopier toner for authentication is made by mixing conventional toner particles with submicron ultraviolet sensitive particles that exhibit detectable characteristics in response to ultraviolet radiation. A document printed using the improved toner can be authenticated using a UV scanner.

System for authenticating printed or reproduced documents

A multiple-reader system for authentication of articles uses a first reader (400) which employs predetermined modulated illuminating light (20) and a multiplicity of discriminating variables, such as wavelengths (110), amplitudes (120), and time delays (140) relative to the modulated illuminating light (20) to characterize fluorescent light (70) detected from fluorescent indicia on the articles. The fluorescent indicia may also incorporate spatial distributions such as bar codes as discriminating features. Additional readers (410 and 420), which may be readers of fluorescent marks and/or readers of other indicia, are synchronized with the fluorescence reader by timing signals. The discriminating features may be re-programmed by the user of the authentication system. Thus the discriminating features define a user-determined and programmable encryption of the articles' authentic identity. The outputs provided by individual readers (400, 410 and 420) are combined by a computer (85) programmed to produce the authentication result. The fluorescence authentication reader includes integration and synchronization of multiple readers of various types, an improved coaxial optics subsystem (450), and electronic circuitry with improved time-base stability, which cooperate in enhancing signal/noise ratio. The resultant stable triggering of the authentication output of the individual fluorescence reader, combined with time synchronization of the individual fluorescence reader with other readers, provides a reliable integrated multi-reader authentication system.

Fluorescence authentication reader with coaxial optics

A release agent is first applied to a target article and on top of the release agent is applied an ultraviolet radiation fluorescent material to enable fraud detection. To prevent fraud, a security label may also be used comprising a label substrate, a release layer, a layer of ultraviolet radiation fluorescent material, and an adhesive layer for adhering to a target article. When the substrate is peeled off, part of the ultraviolet sensitive material will be peeled off also to enable detection.

Tamper resistant system using ultraviolet fluorescent chemicals

Accessory apparatus for authenticating articles is used in conjunction with existing readers or scanners of articles bearing stored data, such as credit cards or identification cards. The accessory apparatus is disposed before, after, on, under, inside, or adjacent to existing reader apparatus, to have a view of the article whose data is to be read. Information in addition to the stored data is coded on the article in non-visible indicia and is detected by the accessory authenticating apparatus. This coded additional information may be related to identification data stored in the article by the article's normal storage mechanism, such as a magnetic stripe or an embedded memory IC chip. The additional information may be coded in various combinations of predetermined characteristics of light emitted by the article to be authenticated when the article is irradiated with non-visible light from the accessory apparatus. The code combinations are preferably complex combinations of the various radiation characteristics. The article is irradiated at a high enough frequency (above 10,000 Hz modulation) for rapid determination of authenticity, and for reading and decoding standard bar codes. Visible and/or audible indicators alert a user when the authentication process detects an invalid card. With certain arrangements, an invalid card may be blocked from being read by the existing reader or scanner. The accessory apparatus may be connected to interrupt the normal communication channel of the existing reader or scanner with which it is used, when an article fails to be authenticated. The accessory apparatus may be used as an adjunct to existing readers or scanners of information on such cards or other articles, to perform authentication functions without replacing or obsoleting such existing readers or scanners.

Methods and apparatus for authenticating data storage articles

Methods and specially adapted reusable test carriers provide for burn-in test of semiconductor integrated circuit devices and economical production of known good dice (KGD). Methods for temporary flip-chip mounting of IC wafers or dice use a hierarchy of solder melting points in combination with improved reusable carrier substrates. IC chip wafers having high-melting-temperature flip-chip terminals are coated with a predetermined volume of a sacrificial solder having a significantly lower melting temperature. A reusable temporary carrier is provided, in a range of sizes adapted for a wafer, small numbers of IC dice, or an individual die, For full-wafer burn-in, the reusable carrier has edge connector terminals. For testing individual dice or a small number of dice, the reusable carrier has conductive elements in a pattern matching each IC dies terminal pattern. The same or opposite side of the reusable carrier has pins or ball-grid array matching a conventional burn-in socket. A preferred reusable carrier consists of separable parts: a substrate customized to carry specific dice for burn-in, and a 'universal' carrier package adapted to fit standard test sockets. After burn-in testing, the known good dice are removed by a low-temperature reflow, and attached to permanent substrates by conventional high-temperature reflow. The test carriers are re-usable after cleaning. A carrier structure similar to the preferred separable structure is specially adapted for testing and/or permanent packaging of IC chips which utilize wire-bond connections.

Methods and apparatus for test and burn-in of integrated circuit devices

A molded plastic package for an integrated-circuit die includes a lead frame having a central die-attach paddle. One side of the die-attach paddle has an integrated-circuit die fixed thereto. A heat sink member is resiliently fixed to the other side of the die-attach paddle using a layer of viscous thermal grease between the heat sink member and the other side of the die-attach paddle. One or more holes are formed in the lead frame and are engaged by corresponding studs on the heat sink. The stud has a shoulder portion which engages the lead frame to prevent the stud from further passing through the hole in the lead frame.

Growing community of inventors

Los Altos, CA, United States of America

Louis H Liang