Emc Corporation

Textron Systems Corporation

Louis H Feinstein

Stuart Douglas Downes

A technique for processing an electronic apparatus (e.g., manufacturing an assembled circuit board, treating an assembled circuit board, etc.) involves applying encasement material to an area of the circuit board assembly while leaving at least a portion of the circuit board assembly exposed. The technique further involves causing the applied encasement material to harden (e.g., heating the encasement material in a curing oven, applying radiation, providing a chemical catalyst, etc.). Application and hardening of the encasement material may take place shortly after circuit board assembly (e.g., by automated equipment at a manufacturing facility in order to treat newly assembled boards) or at some later time in the field (e.g., by a technician servicing a legacy board).

Techniques for direct encasement of circuit board structures

A technique for manufacturing a circuit board involves obtaining a plane-shaped structure having layers of circuit board material integrated together, and carving a hole within the plane-shaped structure (e.g., using a single countersinking drill bit). The carved hole includes an inner portion having a substantially uniform inner portion diameter and a connecting portion disposed between the inner portion and an outer surface of the plane-shaped structure. At least part of the connecting portion has a diameter which is larger than the substantially uniform inner portion diameter of the inner portion to improve access to the inner portion. The technique further involves

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Sharon, MA, United States of America

Louis H Feinstein