Siemens Aktiengesellschaft

Lothar Rapp

Herbert Prussas

Ferdinand Frenkel

Claus-Peter Heitzig

A holder is provided for a cylindrical electrical safety fuse having conductive end caps. A hollow housing receives the fuse therein through a front side which is closeable with a closure cap. A compression spring at a back end of the housing biases the fuse against a conductive metal inner cap disposed interiorly of the end cap. The inner cap has a radially extending contact tab. A terminal pin is provided to conductively engage the contact tab. The terminal pin has a contact portion with a perpendicularly-extending base, a cantilevered front leg extending from and overlying the base, and a cantilevered spring leg extending from a second end of the base so that the spring leg is disposed intermediately between the front leg and the base and also overlies the base. A clamp slot is defined between the front leg and the spring leg to form an electrical contact with the contact tab.

Holder for an electrical safety fuse

A heat dissipating housing (1, 4, 5, 6) with a tub (1, 4) and an outer cover (5, 6) seated on the tub (1, 4)--preferably hermetically tight--for an electronic circuit component (11, 17) which in operation gives off heat to be dissipated such as a light emitting diode (17) and/or a semiconductor driver chip (11) is disclosed. The circuit component (11, 17) is fastened on the bottom (1) of the tub (1, 4). In operation, the heat to be dissipated is to be transferred at least in considerable part via a heat removal body (5, 6) of the housing (1, 4, 5, 6) to an outer surface of the housing, preferably via a heat conducting outer cover (5, 6) serving as the heat removal body (5, 6) to the outer surface air, sweeping the housing. The dissipated heat removal to the cooling medium is improved by especially simple means in that at least a part of the inner surface of the bottom (1) as well as of the sidewalls (4) of the--on the whole--relatively poorly heat conducting tub (1, 4) is lined with at least one lining sheet (2) of good heat conduction, the lining sheet (2) having a transitional section of good heat conduction toward the circuit component (11, 17) as well as toward the heat removal body (5, 6).

Heat dissipating housing for an electronic component

A housing for an optoelectronic circuit module useful in a glass fiber communications system including a luminous flux suspended into the housing. The flux is conducted in a vacuum or a gas, between first and second mutually positioned optical components. The first optical component is attached to the housing via a first support, and a second optical component is attached to the housing via a second support. The first support is installed in one of the housing walls or inside the housing and the second support is rigidly attached to an interior section of the housing. In operation, at least the second support is subjected to large temperature variations of e.g., between -40.degree. C. and +130.degree. C. At least the interior section of the housing which is adjacent to the second support is comprised of a first weldable material and has a first linear thermal expansion coefficient. At least a portion of the second support which is adjacent to the interior section of the housing is comprised of a second weldable material which has a second linear thermal expansion coefficient which differs from the first expansion coefficient. Installed inside the housing is at least one electronic component, e.g., an infrared light-emitting diode which, during operation, produces increases in temperature inside the housing due to waste heat. The second support is located adjacnet to the interior section of the housing, but is welded via only a comparatively small point-like spot to the interior section.

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Munich, Germany

Lothar Rapp