Globalfoundries Inc.

Globalfoundries Dresden Module One Limited Liability Company & Co. Kg.

Lothar Lehmann

Frank G Kuechenmeister

Gotthard Jungnickel

Sven Kosgalwies

Alexander Platz

Marcel B Wieland

Frank G Küchenmeister

Hartmuth Daniel Kunze

Sven Bedürftig

Patrick Rohlfs

Embodiments of the disclosure provide an integrated circuit (IC) structure. The IC structure may include a first metal layer on a substrate, and a second metal layer on the substrate that is horizontally separated from the first metal layer. A dielectric material may include a first portion on the first metal layer, and having a first upper surface, a second portion on the second metal layer, and having a second upper surface, and a third portion on the substrate between the first metal layer and the second metal layer. The third portion of the dielectric material includes a third upper surface above the first upper surface of the first portion and the second upper surface of the second portion of the dielectric material.

Integrated circuit structure with dielectric material to cover horizontally separated metal layers, and related method

One illustrative method disclosed herein includes forming a conductive pad in a layer of insulating material, forming a passivation layer above the conductive pad, performing at least one etching process on the passivation layer to define an opening in the passivation layer that exposes at least a portion of the conductive pad, forming a protective layer on the passivation layer, in the opening and on the exposed portion of the conductive pad, forming a heat-curable material layer above the protective layer, performing an etching process to define a patterned heat-curable material layer having an opening that exposes a portion of the protective layer, performing an etching process on the protective layer to thereby expose at least a portion of the conductive pad and forming a conductive bump that is conductively coupled to the conductive pad.

Methods of forming bump structures that include a protection layer

Growing community of inventors

Radebeul, Germany

Lothar Lehmann