Intel Corporation

Lothar Kress

Michael T Crocker

David Shia

Paul J Diglio

Todd P Albertson

Arun Krishnamoorthy

Christopher Roy Schroeder

Joseph F Walczyk

Todd Michael Young

Sruti Chigullapalli

Charles Clifton Fulton

David Won-jun Song

Robert Levi Bennett

Thermal interface material handing is described for thermal control of an electronic component under test. In one example, a thermal control unit is adapted to control the temperature of at least a portion of an electronic component during testing. A pedestal between the thermal control unit and the electronic component conducts heat from the electronic component to the thermal head. A conduit extends through a portion of the pedestal, to permit the flow of a liquid thermal interface material from an external source to a space between the pedestal and the electronic component. The liquid thermal interface material improves heat conduction between the electronic component and the pedestal. An elastomeric seal between the electronic device and the pedestal constrains the thermal interface fluid within the space between the electronic component and the pedestal.

Thermal interface material handling for thermal control of an electronic component under test

A wire probe assembly and forming process is described. In one example, a method includes inserting a plurality of wires through a probe former and a tip retainer to contact a probe head substrate, attaching the wires to a surface of the substrate, pulling the probe former laterally with respect to the substrate surface and the tip retainer to bend the wires into test probes with a resiliency to transverse movement, and removing the tip retainer to form a test probe head.

Wire probe assembly and forming process for die testing

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Portland, OR, United States of America

Lothar Kress