Robert Boschgmbh

Lothar Gademann

Hartmut Michel

Bernhard Mattes

Botho Ziegenbein

Bernd Maihoefer

Werner Nitschke

Hans-Dieter Schmid

Gerd Hohne

Adam Hirt

Ulrich Drews

Richard Spitz

Bernd Bodig

Anton Mindl

Roland Schmid

Ralf Henne

Wadym Suchowerskyj

Peter Flohrs

Josef Orova

Wolfgang Jacob

Dietrich Bergfried

Emil Buchschmid

Eberhard Mausner

Franz Schmich

Andreas Reppich

Peter Schaedler

Thomas Walker

Stefan Kotthaus

Norbert Rittmannsberger

Klaus Miekley

Gerald Hopf

Michael Schneider

Erich Jesse

Manfred Huttinger

Horst-Gunter Steffen

Ulrich Kippelt

Juergen Hartmann

Reinhold Danner

Klaus Meder

Eberhard Fritz

Bernd Bodig, Deceased

Friedrich-Reinhold Hamann

Frank Kursawe

Hans P Jahn

Johann Tschepella

Herbert Bohm

Wolfgang Jakob

An electronic device includes a resonant circuit and an evaluation circuit. The resonant circuit includes an acceleration-sensitive sensor which is excited to vibrate during a testing phase of the acceleration-sensitive sensor. The evaluation circuit is coupled to the resonant circuit to determine a performance reliability of the acceleration-sensitive sensor.

Electronic device having an acceleration-sensitive sensor

A metal support element having electronic components or circuit supports, in particular hybrid circuits, the connections of which are guided through from the component side, via a plurality of connector pins melted into glass passthroughs, to the opposite side of the support element. The connector pins are glass-mounted into pin blocks produced independently of the support element. The pin blocks are inserted into associated cutouts of the support element and fastened therein. The arrangement and number of the connector pins in the pin blocks can thereby be flexibly adapted to particular requirements with no need for modifications to the design of the support element. The material and the geometrical properties of the pin blocks can be optimally adapted to the glass-mounting process of the connector pins, while the material of the support element can be matched to the coefficient of thermal expansion of the attached circuit support.

Metal support element for electronic components or circuit supports

The composite hybrid semiconductor structure contains a support plate substrate (11) with a number of at least two support connector spots (13) and a semiconductor chip or semiconductor wafer substrate (10) with a number of at least two chip connector spots (16). The structures is distinguished by a respectively thermally and electrically conducting adhesive layer (13') on the surface of the support plate substrate (11) within the areas of the support connector spots (13), where the said substrates (10, 11) with the said connector spots (13, 16) placed opposite each other and in electrically conducting and mechanically firm connection have been brought into connection with each other by the said electrically conductive adhesive layers (13').

Hybrid circuit with an electrically conductive adhesive

An electrical device has at least one electrical power component, a housing including a plurality of housing parts, and a spring element arranged to provide a mechanical and thermal contact of the at least one electrical power component with the housing. The housing parts including a lower housing part which is formed as a metal cover moveable within a predetermined range and the spring element presses the at least one power component in an interior of the housing against the metal cover.

Housing for an electrical device having spring means

A sensor device has a quartz tuning fork and an analysis circuit arranged on a common board inside a common housing. The quartz tuning fork has its own, second housing within the common housing for acoustically decoupling the tuning fork from the analysis circuit. The second housing also has an opening for equalizing the pressure and temperature between the second housing and the rest of the common housing. The analysis circuit, which is connected via the electrical wires to the quartz tuning fork, performs linearization, signal amplification and elimination of environmental influences on the signals emitted by the quartz tuning fork. The signals processed by the analysis circuit are further transmitted via common housing's electrical contacts to external elements. Because of the physical proximity of the quartz tuning fork and the analysis circuit, interference attributable to electrical connections between the two elements is minimized. Furthermore, because the tuning fork and the analysis circuit are exposed to the same temperature, temperature-related fluctuations in the electrical signals of the tuning fork may be accurately counter-balanced by the analysis circuit.

Sensor with quartz tuning fork

An acceleration sensor, which is particularly adapted for use in motor vehicles, is improved by structuring it to be readily testable, to assure reliability before installation. The acceleration sensor has a piezo element (1), which consists of at least two piezo-electric plates (2) placed on top of each other, the piezo-electrical polarization of which is oriented in opposite directions. At least two electrodes (9) are placed on each of the topside (7) and the underside (8) of the piezo element (1). For testing the sensor, the piezo element is deformed by the application of an electrical voltage to electrodes (9) of a first lateral portion (11a) of the piezo element. This deformation is detected by means of a deformation-generated voltage at the electrodes (9) of a second lateral portion (11b) of the piezo element.

Acceleration sensor with oppositely-polarized piezoelectric plates

Power output stage having a darlington-pair circuit for switching an

A circuit arrangement for operating a gas-discharge lamp is proposed, in which the high voltage for starting the gas-discharge lamp is generated by means of the energy stored in a transformer or capacitor. In order to obtain a steep rise in voltage of the starting voltage, the starting voltage is provided to the gas-discharge lamp via a voltage-controlled switch. A break-over diode, which has very short switching times, is proposed as the voltage-controlled switch. The starting circuit is switched off after starting. This circuit arrangement is also particularly suitable for starting gas-discharge lamps which are warm from operation. In consequence, it is particularly suitable for motor vehicle headlights.

Circuit arrangement for operating a gas-discharge lamp

In a safety device for vehicle occupants with acceleration-sensitive sensors and with processing circuits for the sensors summing and integrating devices as well as a comparator device for comparing the summation and integration values are provided. The comparator device controls a warning device as soon as the comparison value exceeds a presettable limit value.

Safety device for vehicle occupants

To reduce the size of a rectifier structure in a vehicular alternator-rectifier combination, a common carrier plate of essentially half-moon or sickle shape, having two wing portions separated by a central portion (31) retains two support plates (20) of essentially square outline. Groups of positive and negative diodes are located in the vicinity of the corners of the essentially square suppport plates, interconnected by connecting buses extending in chord relation with respect to the common carrier plate (22). Exciter or field diodes (13, 33) are positioned in the central portion, free from the support plates and the positive and negative diodes thereon. Four positive and negative diodes can be provided, in which a fourth diode pair (16) is connected to a star or center terminal of the alternator winding. The common carrier plate is formed with an upstanding rim so that the entire rectifier can be encapsulating in a potting or resin compound.

Three-phase alternator diode heat sink structure

An integrated anode power stage using one or more Darlington transistors combinations is constituted for currents exceeding 5 amperes and voltages exceeding 200 volts. On a common semiconductor substrate there are provided, in addition to the Darlington circuit or circuits a large number of peripheral components, both active and passive, such as are required for protection, regulation and turning on or off of the final stage for operating an ignition coil in a motor vehicle. By providing these components in basins of the same conductivity type as the base of the power transistor a unit is provided that is economical to make as well as compact and reliable.

Integrated circuit Darlington transistor power stage incorporating

To facilitate assembly and provide for high-level output from a deceleration sensor which provides, inherently, only very low level output, an evaluation circuit, such as an amplifier structure, is connected immediately adjacent the deceleration sensor on a common metal plate, interconnected thereby by bonding wires, the common plate having connecting pins (18) passing therethrough for connection to a standard plug-and-socket connector; the evaluation circuit and the deceleration sensor are enclosed within a common sealed housing, so that both the deceleration sensor (12, 12') as well as the evaluation circuit (16, 17) are sealed against ambient influences, preferably retained within a high-viscosity fluid, such as insulating oil. All elements can be located on one side of the housing, in which a standard T5 transistor housing is suitable; or the deceleration sensor may be located on the other side of the metal plate (10) from the evaluation circuit, in which case a plastic housing can be used, only the deceleration sensor being secured to the metal plate by a metal housing cap, sealed to the metal plate.

Trigger system for a vehicular passenger restraint system

Ignition system for internal combustion engines with a magnet generator

To prevent damage upon removal of a locating templet used in positioning a plate-like semiconductor on a support carrier (2, 14), for example a base plate (2) of a transistor housing or a metallized surface of a ceramic insulator (14), the locating templet (9) is made of solderable material, positioned with respect to the carrier structure by interengaging projection-and-recess elements (10, 10', 11) and soldered to the carrier in one soldering operation, the templet remaining on the carrier structure and forming part of the semiconductor element. If the carrier structure is the metallized coating of a ceramic, the templet may then be used as a terminal connection point for a connection or bonding wire connected to an internal portion of a connection pin extending through the housing of the semiconductor structure.

Semiconductor structure and method of its manufacture

A cooling plate, the hybrid electronic circuit and a circuit board connection plate, are mounted flat at the bottom of a cup-shaped vessel with a reentrant tube for an iron core leg, in which vessel the secondary winding on its spool and a primary winding set inside the spool are put for being imbedded in a casting resin. The vessel and its contents fits over the central core leg of an E-shaped stationary armature of a magneto generator for a one-cylinder internal combustion engine.

Magneto ignition unit with control circuit potted together with the

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Rottenburg, Germany

Lothar Gademann