Orga Kartensysteme Gmbh

Orga Systems Gmbh

U-nica Technology Ag

Lothar Fannasch

Dirk Fischer

Michael Hennemeyer-Schwenker

Frank Kappe

Matthias Schumacher

Michael Hennemeyer-Schwenkner

Mathias Schumacher

Frank Bormann

The invention relates to a card-shaped data carrier consisting of at least one layer (). Visually readable information in the form of a changed optical characteristic is introduced into the layer. Said characteristic is changed by irreversibly changing the material by means of a laser beam. The absorption capacity of said layer () for at least one wavelength (&#x3bb;&#xb1;&#x3bb;) is at least partially reduced due to the laser radiation.

Card-shaped data carrier and method for producing same

A description is given of a method for applying colored information to an object (), the object having at least two different chromophoric particles, at least in a layer (A) close to the surface, which change the color of this layer (A) under the influence of laser radiation, According to the invention, at least one beam guiding means () is provided in order to guide a first laser beam () having the wavelength (&#x3bb;) and at least one further laser beam () having a wavelength (&#x3bb;), which is different from the wavelength of the first laser beam, via the two-coordinate beam deflection device () and the focusing device () onto the layer (A) of the object ().

Method for applying colored information on an object

The invention relates to a method for the recording of data, in particular, personal data on and/or in a data support, by means of electromagnetic radiation. A corresponding data support is made ready, on and/or in which a dye is at least locally provided and said dye is irradiated by means of said electromagnetic radiation of at least one wavelength range, such that a change in the color of the dye by bleaching occurs in the region of the irradiation. Said color change may be determined by machine and/or by the human eye. An improved counterfeiting and manipulation security for the data support is thus achieved.

Method for the recording of data on/in data supports by means of laser radiation and data supports produced thus

The invention relates especially to a method for producing a product that is secure against fraud, i.e. a security product. The inventive method for producing a security product with a high degree of protection against fraud or tampering is characterized as follows: in a first step, a non-personalized and/or non-individualized support is provided with a non-personalized and/or non-individualized security element ( ); in a second step and/or in further steps, the non-personalized and/or non-individualized support and the non-personalized and/or non-individualized security element ( ) are personalized and/or individualized; a structure ( ) that is optically effective in the security element ( ) produces at least two especially, color effects; at least one of the color effects ( ) only appears within a certain angular range to a vertical to the surface of the security element, and a personalizable and/or individualizable layer ( ) that is provided in the security element ( ) and/or a personalized and/or individualized layer that is provided in the security element ( ) shows personalization and/or individualization information.

Product with a security element

A conductor track supporting layer for laminating inside a chip card includes at least one conductor track and connecting areas that are connected to the conductor track. The conductor track is applied to the conductor track supporting layer during a screen printing method and is made of a screen printing paste. The conductor track supporting layer has indentations which are located in the area of the connecting areas and which are filled with the screen printing paste during the screen printing process. As a result, it is possible to produce conductor track supporting layers provided with connecting areas of varying thicknesses which enable the production of recesses in the chip cards, after the conductor track supporting layers are laminated in chip cards. These recesses expose the connecting i, areas for connection to electronic components. And, the sensitive strip conductors, also located in the chip card, are prevented from becoming damaged.

Conductor track supporting layer for laminating inside a chip card, chip card comprising a conductor track supporting layer, and method for producing a chip card

Disclosed is a method for producing a chip card which is provided with a plastic card body ( ) comprising several layers, an integrated circuit that is arranged in a chip module ( ) and at least two additional electronic components ( ) for producing an interactive chip card. The components and the chip module are connected to each other by means of strip conductors ( ) which are arranged on a carrier layer ( ) and metallic contact surfaces ( ) which are connected to the conductors. According to the invention, several cover layers ( ) are mounted on the conductor carrier layer. Said cover layers are provided with recesses ( &prime;) corresponding to the metallic contact surfaces ( ). The individual card layers of the plastic card body ( ) are laminated and as a result the metallic contact surfaces ( ) are pushed upwards within the recesses ( &prime;) of the cover layers ( ) to a point where said contact surfaces rest on a cover layer ( ) or a thickness compensation layer ( ), whereby said recesses are arranged above the contact surfaces. Three-dimensional conductor carrier layers ( ) can be easily produced by means of the inventive method in such a way that electronic components of different thicknesses can be introduced into the chip card body without entailing problems.

Method for producing a multi-layer chip card

A method for manufacturing a chip card comprising a multi-layer plastic card body; an integrated circuit arranged within a chip module; at least one coil which serves for the energy supply and/or the data exchange between the integrated circuit with external devices, with the chip module having at least two metallic contacts for an electrically conducting connection of the integrated circuit with the terminals of the coil arranged on a coil carrier layer, comprising the steps of: providing the coil carrier layer with the coil and the coil terminals being arranged on same; providing a cover layer to be applied onto the coil carrier layer on the side of the coil terminals, with the cover layer comprising recesses which correspond to the coil terminals; providing at least one thickness compensation layer to be applied onto the cover layer; stacking of the card layers in registered relationship, with the cover layer being positioned in such a manner that each of the recesses in the cover layer comes to lie in the area of the coil terminals; placing the stacked card layers into a lamination press where the card layers are combined with each other under pressure and heat whereby during lamination synthetic material compound of the coil carrier layer is pressed into the recesses of the cover layer raising the coil terminals; removal of the laminated cards from the lamination press; recess milling of a recess for accommodating the chip module in the laminated card body, whereby the raised coil terminals are exposed; and fitting the chip module into the recess of the card body and making an electrically conducting connection between the contacts of the chip module and the coil terminals.

Growing community of inventors

Bielefeld, Germany

Lothar Fannasch