Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

University of Utah Research Foundation

Lothar Dietrich

Andreas Ostmann

Elke Zakel

Paul Kasulke

Rolf Aschenbrenner

Hermann Oppermann

Frank Ansorge

Hans-Hermann Oppermann

Florian Solzbacher

Richard A Normann

Matthias Klein

Michael Töpper

Ralf Schmidt

Reid R Harrison

Morten Brink

Gunter Engelmann

Wolf Jürgen

The invention relates to a cyanide-free formulation for the electrodeposition of a layer of gold and silver on electrically conductive substrates, wherein the formulation respectively contains a complexing agent from the group of sulfites and thiosulfates and is characterized in that at least one transition metal from the 5th or 6th sub-group is added in the form of the soluble oxygen acid thereof in order to increase the bath stability.

Aqueous formulation for creating a layer of gold and silver

The invention relates to a device and method for producing targeted flow and current density patterns in a chemical and/or electrolytic surface treatment. The device comprises a flow distributor body which is disposed, with the front face thereof, plane-parallel to a substrate to be processed, and which has outlet openings on the front face, through which process solution flows onto the substrate surface. The process solution flowing back from the substrate is led off through connecting passages onto the rear face of the flow distributor body. At the same time a targeted distribution of an electrical field on a conductive substrate surface is effected by a specific arrangement of said connecting passages.

Device and method for producing targeted flow and current density patterns in a chemical and/or electrolytic surface treatment

A method for producing a nanoporous layer comprises applying a plating base with adhesion strengthening onto a substrate, depositing a layer made of gold and silver onto the substrate, the composition being in the range of 20% to 40% gold and 80% to 60% silver, and selectively removing the silver in order to produce a nanoporous gold layer.

Method for producing a nanoporous layer

Interconnect metallization schemes and devices for flip chip bonding are disclosed and described. Metallization schemes include an adhesion layer, a diffusion barrier layer, a wetable layer, and a wetting stop layer. Various thicknesses and materials for use in the different layers are disclosed and are particularly useful for metallization in implantable electronic devices such as neural electrode arrays.

Flip chip metallization method and devices

Method and apparatus for the testing of substrates which are provided with a wiring structure, in particular, chips (,), in conjunction with which, by means of a solder-deposit carrier (,) which is provided with a structured, electrically conductive coating (,) with bond pads (,) for the arranging of solder deposits (,) and their transfer to correspondingly arranged bond pads (,) of a substrate (,), an electrical check of the wiring structure of the substrate (,) takes place during the transfer of the solder deposits (,).

Method and apparatus for testing chips

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Werder, Germany

Lothar Dietrich