Digital Equipment Corporation

Lori A Treseder

Ralph M Tusler

Mark S Lewis

Reuben Michael Martinez

Greg Suzda

Modular enclosure for electronic equipment

A simple, low cost, reduced tolerance interconnect enclosure in which a blind m A siVpV:interconnect between modules and the backplane may be guaranteed without the need for assembly fixtures or floating connectors, and a method of manufacturing the enclosure. The enclosure includes two matching enclosure sections for holding a backplane. The backplane has spaced apart recesses on opposing edges. Each enclosure section includes alignment protrusions spaced apart to engage the backplane recesses. These protrusions have curved apex regions and a height greater than the depth of the backplane recesses. Means for latching the enclosure sections together are provided, and the enclosure sections are dimensioned such that when the enclosure sections are closed around the backplane, the protrusions from the enclosure sections are urged against the recesses on the backplane. The resulting multi-point-of-contact interference fit between the backplane recesses and alignment protrusions automatically centers the backplane in the shelf. The process for manufacturing the enclosure includes the steps of drilling holes in a panel and routing the backplanes from the panel such that the routing path crosses the drilled holes, creating recesses on the backplane edges. The enclosure sections are manufactured according to a unitary injection molded plastic process.

Growing community of inventors

Colorado Springs, CO, United States of America

Lori A Treseder