Lam Research Corporation

Loreta Tamasauskaite-Tamasiunaite

Yezdi N Dordi

Aniruddha Joi

Eugenijus Norkus

Aldona Jagminiene

Ina Stankeviciene

Albina Zieliene

Zita Sukackiene

A solution for electroless deposition of platinum is provided. The solution comprises Coions, Ptions, and amine ligands. A ratio of Coto Ption is between 100:1 and 2:1. The solution allows for electroless deposition of platinum without requiring high temperatures and high pH. The solution allows for the deposition of a pure platinum layer.

[object Object]

A method for providing an electroless plating of a platinum containing layer is provided. A Tistabilization solution is provided. A Ptstabilization solution is provided. A flow from the Tistabilization solution is combined with a flow from the Ptstabilization solution and water to provide a diluted mixture of the Tistabilization solution and the Ptstabilization solution. A substrate is exposed to the diluted mixture of the Tistabilization solution and the Ptstabilization solution.

Electroless deposition of continuous platinum layer

A solution for electroless deposition of cobalt is provided. A reducing agent of Tiions is provided to the solution. Coions are provided to the solution.

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Vilnius, Lithuania

Loreta Tamasauskaite-Tamasiunaite