Broadcom Corporation

Other

Lorenzo Longo

Ichiro Fujimori

Vivek Telang

Tuan Hoang

Ben Tan

Afshin Momtaz

Sudeep Bhoja

Ali Ghiasi

Armond Hairapetian

Vasudevan Parthasarathy

Chung-Jue Chen

Abbas Amirichimeh

Mohammad Tabatabai

Hong Chen

Michael Furlong

A short reach communication system includes a plurality of communication SERDES that communicate data over a short reach channel medium such as a backplane connection (e.g., PCB trace) between, for example, chips located on a common PCB. A multi-level modulated data signal is generated to transmit/receive data over the short reach channel medium. Multi-level modulated data signals, such as four-level PAM, reduce the data signal rate therefore reducing insertion loss, power, complexity of the circuits and required chip real estate.

Use of multi-level modulation signaling for short reach data communications

A system and method are disclosed for supporting 10 Gigabit digital serial communications. Many of the functional components and sublayers of a 10 Gigabit digital serial communications transceiver module are integrated into a single IC chip using the same CMOS technology throughout the single chip. The single chip includes a PMD transmit/receive CMOS sublayer, a PMD PCS CMOS sublayer, a XGXS PCS CMOS sublayer, and a XAUI transmit/receive CMOS sublayer. The single chip supports both 10 Gigabit Ethernet operation and 10 Gigabit Fiber Channel operation. The single chip interfaces to a MAC, an optical PMD, and non-volatile memory.

System and method for implementing a single chip having a multiple sub-layer PHY

Methods and apparatus for improved electromagnetic interference (EMI) shielding and thermal performance in integrated circuit (IC) packages are described. A die-up or die-down package includes a protective lid, a plurality of ground posts, an IC die, and a substrate. The substrate includes a plurality of ground planes. The IC die is mounted to the substrate. Plurality of ground posts is coupled to plurality of ground planes that surround IC die. Protective lid is coupled to plurality of ground posts. The plurality of ground posts and the protective lid from an enclosure structure that substantially encloses the IC die, and shields EMI from and radiating towards the IC die. The enclosure structure also dissipates heat generated by the IC die during operation.

Apparatus and method for grounding an IC package lid for EMI reduction

A system and method are disclosed for supporting 10 Gigabit digital serial communications. Many of the functional components and sublayers of a 10 Gigabit digital serial communications transceiver module are integrated into a single IC chip using the same CMOS technology throughout the single chip. The single chip includes a PMD transmit/receive CMOS sublayer, a PMD PCS CMOS sublayer, a XGXS PCS CMOS sublayer, and a XAUI transmit/receive CMOS sublayer. The single chip supports both 10 Gigabit Ethernet operation and 10 Gigabit Fibre Channel operation. The single chip interfaces to a MAC, an optical PMD, and non-volatile memory.

Embodiments include a system for performing dispersion compensation on an electromagnetic signal received over a communication channel, the electromagnetic signal bearing information at a symbol rate. An interleaved analog to digital converter ('ADC') block may be used, wherein the interleaved ADC block may be configured to generate a plurality of digitally sampled signals from the electromagnetic signal. An interleaved equalizer block may be configured to digitally process each of the digitally sampled signals generated by the ADC block to generate a plurality of digitally equalized signals. A multiplexer may be configured to aggregate the digitally equalized signals into a composite output signal.

Electronic dispersion compensation utilizing interleaved architecture and channel identification for assisting timing recovery

A circuit, system, and method are provided for imparting improved randomness into the selection of components or elements of a data converter, such as a D/A converter. The elements are intended to be of equal value, however, regardless of whether they are or not. A circuit is used to randomly select subsets of elements according to a bi-directional selection technique in order to effectively rending the elements or components of equal value. Associated with each component is a switch, and a subset of the plurality of components are correspondingly switched in successive order progressing in a first direction and, subsequently, in successive order progressing in a second direction opposite the first direction. Connecting components in a first direction from left-to-right follows by selecting components in a second direction from right-to-left, and then again selecting components in the first direction from left-to-right, and so forth. A pointer will note the starting element of odd values and another pointer will note the starting element of even values. The pointers are updated each time a corresponding odd code value and even code value is sent to the data converter.

Growing community of inventors

Laguna Beach, CA, United States of America

Lorenzo Longo