Atotech Deutschland Gmbh

Schering Aktiengesellschaft

Lorenz Kopp

Reinhard Schneider

Thomas Rydlewski

Ralf-Peter Wachter

Ferdinand Wiener

Henry Kunze

Horst Steffen

Manfred Maurer

Rolf Schroder

Peter Langheinrich

Heinrich Knorr

Helmut Scharrer

Jens Geissler

Ralf-Peter W&auml;chter

Wolfang Pl&ouml;se

Jens-Eric Geisler

Werner Rossmann

A nozzle arrangement is described which may in particular be used as a flow nozzle in galvanization systems with horizontal throughput of printed-circuit boards. The nozzle arrangement comprises a longitudinal housing () with at least one fluid feed opening to feed a treatment fluid for treating a work piece, for example a printed-circuit board, and preferably a plurality of slotted fluid delivery openings () for releasing the treatment fluid. In the housing () a fluid channel () is formed for feeding the treatment fluid from the fluid feed opening to the fluid delivery openings (). In order to achieve the most even possible flow speed of the treatment fluid at the fluid delivery openings (), (a) the throughput of the fluid channel () for the treatment fluid reduces continuously from the fluid feed opening in the longitudinal direction of the housing () and/or (b) before the delivery of the fluid from the fluid delivery openings () a storage chamber is provided.

Nozzle arrangement

A method and an apparatus are described for regulating the concentration of metal ions in an electrolytic fluid, which is used for the deposition of metal with insoluble anodes and additionally contains compounds of an electrochemically reversible redox system. With the oxidized form of said system, metal is dissolved in an ion generator , traversed by the fluid, so that these compounds are thereby reduced. For the deposition of metal, the dissolved metal ions on the item to be treated are reduced. The compounds of the redox system in the reduced form are oxidized again on the insoluble anodes in the electroplating system . In order to keep the concentration of the metal ions in the electrolytic fluid constant, at least a portion of the electrolytic fluid, contained in the electroplating system, is conducted through one or a plurality of electrolytic auxiliary cells

Method and device for regulating the concentration of substances in electrolytes

Device and method for evening out the thickness of metal layers on electrical contact points on items that are to be treated

The apparatus for electrolytically treating printed circuit boards,, through which apparatus the printed circuit boards are continuously guidable in a plane of conveyance in a substantially horizontal direction of conveyance, has the following features: Counter-electrodes,are disposed opposite the plane of conveyance and substantially parallel thereto on at least one side, so that electrolytic chambers,are formed between counter-electrodes, which are situated opposite one another, or between the counter-electrodes and the plane of conveyance, the counter-electrodes forming respective substantially continuous electrode faces. Guide elements,for the printed circuit boards are disposed in the electrolytic chamber. Contact elements,are provided for the electrical contacting of the printed circuit boards. Electrolyte spraying arrangements,are also provided for conveying the electrolytic fluid towards the surfaces of the printed circuit boards. Openings are provided in the counter-electrodes. The electrolyte spraying arrangements are disposed on the sides of the counter-electrodes remote from the plane of conveyance in such a manner that electrolytic fluid, emerging from the arrangements, can pass the counter-electrodes substantially unhindered at the locations of the openings and can pass to the surfaces of the printed circuit boards.

Device for electrolytic treatment of printed circuit boards and conductive films

The apparatus according to the invention is used for electrolytically treating a board-shaped substrate to be treated, preferably printed circuit boards, in a continuous system, through which the item to be treated is guidable in a plane of conveyance in a substantially horizontal direction of conveyance, the apparatus having counter-electrodes (,), which are situated substantially parallel to one another opposite the plane of conveyance, and screens (,) for shielding from high current density fields in the edge region of the item to be treated (,), said screens being disposed between the plane of conveyance and the counter-electrodes, the screens each being in the form of at least two flat portions (,), which are disposed substantially parallel to each other, one portion (,) of the screens being disposed so as to lie opposite the plane of conveyance, and the other portion (,) being disposed so as to lie opposite the counter-electrodes, and the screens being mounted so as to be displaceable in a direction (,) which extends substantially parallel to the plane of conveyance and substantially perpendicularly relative to the direction of conveyance (,). The usable region of printed circuit board blanks can be extended by this apparatus down to an edge of about 12 mm, where the required tolerance of the layer thickness of the deposited metal cannot be maintained.

Method and apparatus for electrolytically treating a board-shaped substrate comprising shielding edge regions of the substrate during electrolytic treatment

Process for maintaining a constant concentration of substances in an

Method and device for the electrochemical treatment with treatment

Method and device for galvanizing plate-shaped products in horizontal

An arrangement for galvanization of treatment goods, such as for example electronic printed circuits, comprises a plurality of successively arranged baths accommodated in bath container units having open sides, covers for selectively covering the upper sides of the container units, units for aspirating vapors located in the bath containers above a liquid level of a bath liquid, units for introducing and withdrawing treatment goods into and out of the bath. The aspirating units include air aspiration inlets located at such a distance under an upper edge of the container units that whirling of an aspirated air is substantially eliminated and a substantial part of the vapors in a space above the liquid level is entrained by the aspirated air. The aspirating inlets are arranged above a maximum bath height, and the cover being arranged at such a height and being dimensioned relative to the container units so that an air passage is produced between the cover and the container unit.

Arrangement for galvanization of treatment goods in a series of baths

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Altdorf, Germany

Lorenz Kopp