Clean Metal Technologies, LLC

Tgs Solutions, LLC

Loren L Hatle

James Joseph Knocke

A method of preparing and decontaminating a substrate surface to remove contaminants including the steps of applying a first dry or fluid composition having a pH of 4 or less comprising an acidifier and an oxidizer, allowing the first composition to remain on the substrate surface for a predetermined period of time, and rinsing the first composition from the substrate surface with a second composition having a pH of 8 or more comprising an alkaline material liquid mixture formed utilizing activated carbon filtered potable water to achieve a neutral pH condition on the surface, and then applying a nanotubes coating on the surface.

Methods for removal of reaction sites on metal surfaces and application of a nanotube containing protective coating

Methods for removal of reaction sites on metal surfaces and application of a nanotube containing protecting coating

A method for passivating substrate surfaces by removing surface contaminants. The method can remove impurities and components from the surface of a substrate to prevent corrosion and undesirable chemical activity. The method further provides an optimized surface for the application of protective barrier coatings. The method provides significant cost savings due to increased life of substrate, reduced maintenance, and superior barrier coating performance.

Method for passivating substrate surfaces

A powder treatment kit for decontaminating metal and metal containing surfaces, removing mill scale, improving the integrity of weldments, removing sulfides, greatly reducing surface oxidation, and mitigating the failure of protective coatings. The powder treatment kit for cleaning substrate surfaces for removal of water and non-water soluble oxides, ionic compounds, oxidized metal species, or other contaminants, comprising a surface pH modifier with a weight percent from 30 percent to 90 percent; a water-soluble oxidizer to react with non-water-soluble sulfides attached to the metal surface, to be dispersed, in an amount from 0.1 wt % to 50 wt %; a pH buffer to maintain a resulting solution pH from 1.5 weight percent to 69.8 weight percent; and a surface tension reducing component.

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Humble, TX, United States of America

Loren L Hatle