Asm Technology Singapore Pte Ltd

Loon Aik Lim

Charles Joseph Vath, Iii

Teng Hock Kuah

Shu Chuen Ho

Man Ho Hui

Juay Sim Koh

A capillary tip for deforming a bonding wire during bonding of the wire to a bonding surface comprises a bottom face along an inner periphery of the capillary tip for pressing the bonding wire against a bonding surface, an outer radius along an outer periphery of the capillary tip, and includes a first inclined face adjacent to the bottom face and extending obliquely to the bottom face as well as a second inclined face adjacent to the first inclined face and extending obliquely to the first inclined face.

Capillary for wire bonding

A mold ( ) is for molding a one-sided encapsulated electronic device. The mold ( ) includes a first mold section ( ) defining a mold cavity ( ), and a second mold section ( ) including a first recessed portion ( ) adapted to receive a layer of material ( ) attached to a leadframe ( ), but not the leadframe ( ).

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Singapore, Singapore

Loon Aik Lim