Intel Corporation

Longqiang L Zu

Jennifer A Hester

Huong T Do

A circuit package has been described for routing long traces between an electronic circuit, such as a phase locked loop, and external circuit components. The traces are routed through two substrates. In each substrate, the traces are routed primarily on a layer adjacent to and between a pair ground planes located close to the traces. Degassing apertures are located to the side of the long traces to avoid interfering with the shielding provided by the grounds planes. The circuit package uses two power plated through holes and two ground plated through holes to reduce the noise on the power supply lines. The circuit package also separates the signal carrying plated through holes from the power plated through holes, which reduces noise on the long traces. Noise is further reduced on the long traces by using the ground plated through holes to shield the signal carrying plated through holes from noise generated at the power plated through holes.

Circuit package for electronic systems

An organic land grid array having multiple built up layers of metal sandwiching non-conductive layers, having a staggered pattern of degassing holes in the metal layers. The staggered pattern occurs in two substantially perpendicular directions. Traces between the metal layers have reduced impedance variation due to the degassing hole pattern.

Degassing hole design for olga trace impedance

The present invention is a method and apparatus to minimize via inductance in a multi-layer organic land grid array (OLGA) packaging. A plurality of layers are staggered vertically. The plurality of layers include first and second layers which have first and second metal strip connections, respectively. The second layer is above the first layer. The first metal strip connection is aligned with the second metal strip connection to maximize mutual inductance between the first and second layers.

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Phoenix, AZ, United States of America

Longqiang L Zu