Hisense Broadband Multimedia Technologies Co., Ltd.

Hisense Broadband Multimedia Technologies, Ltd.

Hisense USA Corporation

Hisense International Co., Ltd.

Long Zheng

Sigeng Yang

Hua Zhang

Li Wang

Yaqian Dong

Chungang Zhang

An optical module including a circuit board, a circuit adapter board disposed on and electrically connected to the circuit board, a silicon optical chip disposed on and electrically connected to the circuit adapter board, an optical fiber socket optically connected to the silicon optical chip through a first optical fiber ribbon, and a light source disposed on and electrically connected to the circuit board and optically connected to the silicon optical chip through a second optical fiber ribbon; wherein a thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board, the silicon optical chip is provided with optical waveguide end facet on a side thereof configured to be butted with the first optical fiber ribbon and the second optical fiber ribbon, and the circuit adapter board has a notch on a side thereof proximate to the optical waveguide end facets.

Optical module

An optical module includes a shell, a circuit board, a light source, and a silicon optical chip. The circuit board is located in the shell, a hollow portion is provided in the circuit board, and the hollow portion penetrates the circuit board. The light source includes at least one laser assembly, and the at least one laser assembly is mounted on the shell and is located in the hollow portion, and the at least one laser assembly is electrically connected to the circuit board. The silicon optical chip is mounted on the shell and is located in the hollow portion. The silicon optical chip is electrically connected to the circuit board and is connected to the light source.

An optical module includes a circuit board and a silicon optical chip. The circuit board includes a plurality of circuit board bonding pads. The silicon optical chip includes a plurality of chip bonding pads corresponding to the plurality of circuit board bonding pads. The plurality of chip bonding pads are electrically connected to the corresponding circuit board bonding pads, so that the silicon optical chip is electrically connected to the circuit board. A chip bonding pad is electrically connected to at least one corresponding circuit board bonding pad through a plurality of bonding wires, or a circuit board bonding pad is electrically connected to at least one corresponding chip bonding pad through a plurality of bonding wires. A connecting line of two or more of bonding positions of the plurality of bonding wires on the circuit board bonding pads is inclined with respect to a connecting line of centers of the circuit board bonding pads.

An optical module has an optical port and an electrical port, and includes a shell, a circuit board, a circuit adapter board, a silicon optical chip, a light source and an optical fiber socket. The circuit board is disposed in the shell. One end of the circuit board is provided with a connecting finger located in the electrical port. The circuit adapter board is disposed on and electrically connected to the circuit board. A thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board. The silicon optical chip is disposed on and electrically connected to the circuit adapter board. The light source is disposed on the circuit board, is electrically connected to the circuit board, and is optically connected to the silicon optical chip. The optical fiber socket is optically connected to the silicon optical chip, and is configured to form the optical port.

This disclosure relate to power control of an optical module. In one implementation, an optical module is disclosed. The optical module comprises a first edge connector pin, a microcontroller unit (MCU), and a power supply control unit disposed on a circuit board, wherein the first edge connector pin is configured to receive a control signal sent by a main-unit device during power up of the optical module; the MCU is electrically connected to the first edge connector pin and the power supply control unit, and is configured to read the control signal using the first edge connector pin, and when the control signal is a first-type control signal, send a corresponding type indication information to the power supply control unit; and the power supply control unit is configured to receive the type indication information sent by the MCU, and stop, according to the type indication information, supplying power.

An optical module includes a gold finger, a comparing unit and a voltage dividing unit. The gold finger includes a plurality of pins. A first pin of the plurality of pins is capable of being multiplexed. The comparing unit includes a first input, a second input and a first output. The first input is connected with the first pin. The second input is configured to receive a reference voltage. The first output is configured to output an output voltage. The voltage dividing unit includes a third input and a second output. The third input is configured to receive a voltage input. The second output is connected with the first pin and configured to regulate a voltage on the first pin, so that the first input of the comparing unit receives a regulated voltage. Voltages of different levels are output by the comparing unit based on a comparison result between an input voltage of the first input of the comparing unit and the reference voltage of the second input.

The present disclosure generally relates to optical modules, and in particular, to an optical module comprising a printed circuit board for reducing crosstalk between differential signal lines. In one implementation, the printed circuit board comprises a top layer, a first intermediate signal transmission layer, a second intermediate signal transmission layer, a bottom layer and multiple ground layers between signal transmission layers. Each signal transmission layer comprises one or more differential signal line pairs. The top layer and the bottom layer each comprises an edge connector, and the top layer further comprises a laser driver chip. The signal transmission layers are connected to the edge connectors and laser driver chips via a combination of blind and through connection holes such that the interference between the differential signal line pairs of various signal transmission layers are reduced.

Some embodiments of the present application provide an optical module, including: a master control chip and a laser receiver; the laser receiver being connected to the master control chip; where the laser receiver includes: a PIN photodiode, a trans-impedance amplifier, a lens, and a shell; the PIN photodiode being electrically connected to the trans-impedance amplifier; and the lens being coated with an antireflection film; where the optical module further includes a bracket and a claw, where the laser receiver is fixed between a housing of the optical module and the bracket by the claw.

The present disclosure discloses an optical module, and relates to the field of optical fiber communication technologies. A first sealing piece is configured to block the gap between the optical fiber ribbon and the blocking piece. For the optical module and an optical communication terminal provided in the present application, an electromagnetic wave generated by the optical module is directly radiated or is reflected several times until the electromagnetic wave enters a wave-absorbing pad. The wave-absorbing pad absorbs to the greatest extent an electromagnetic wave generated by a chip, and can reduce to the greatest extent electromagnetic interference (EMI) generated by the optical module. By means of the present disclosure, the sealing performance of a housing of the optical module can be improved, so that an EMI shielding effect is improved, thereby effectively reducing EMI.

This application discloses an optical module, including a circuit board, a lens assembly, a laser driver, and a limiting amplifier. Heat dissipation layers are disposed on the upper and lower surfaces of the circuit board. The laser driver and the limiting amplifier are mounted on the surface of the heat dissipation layer on the upper surface. Via holes are provided in projection regions of the laser driver and the limiting amplifier on the circuit board. Via holes penetrate the circuit board and are connected to the heat dissipation layers. Via holes are filled with a heat conductor, and the heat conductor is connected to the heat dissipation layers on the upper surface and the lower surface of the circuit board. The optical module disclosed in this application effectively dissipates heat generated by the laser driver and the limiting amplifier, thereby reducing the temperature in the optical module.

This disclosure relates to optical module. In one implementation, the optical module includes a multi-layer circuit board, a first optical chip, a second optical chip, and a processor, wherein a surface layer on a same side of the circuit board comprises a first row of edge connector pins and a second row of edge connector pins; the first row of edge connector pins comprise a first power pin; the second row of edge connector pins comprise a second power pin; the first power pin is connected to the first optical chip; the second power pin connected to the second optical chip and the processor; the first power pin and the second power pin are aligned along a same direction and are arranged at a same position among the first row of edge connector pins and the second row of edge connector pins; and the first power pin is electrically connected to the second power pin. In another implementation, the first power pin and the second power pin is not electrically connected and wherein the circuit board further comprises a power delay circuit between the second power pin and the processor.

This disclosure discloses an optical module and a method for controlling optical module. The optical module includes a controller and a port, wherein the controller is configured to receive a state signal from an optical chip, the state signal is a continuous signal, and output a non-continuous signal to a port pin of the port according to the state signal; the port pin is configured to output the non-continuous signal, and receive a non-continuous response signal in an interval period of the non-continuous signal; and the controller further also configured to receive the response signal from the port pin, and control a power supply to supply power according to the response signal.

Optical module and method for controlling optical module

Some embodiments of the present application provide an optical module, including: a master control chip, a laser transmitter, and a laser receiver; the laser transmitter and the laser receiver being connected to the master control chip, respectively; where the laser receiver includes: a PIN photodiode, a trans-impedance amplifier with a transimpedance of no less than 43K ohms, a lens, and a shell; the PIN photodiode being electrically connected to the trans-impedance amplifier; the PIN photodiode, the trans-impedance amplifier and the lens being encapsulated within the shell in a manner of transistor out-line; and the lens being coated with an antireflection film.

The present application provides an optical module comprising: a golden finger, a MAC chip, a switch circuit, a laser driver, and a laser. A first output terminal of the MAC chip is connected to a first input terminal of the laser driver for inputting burst controlling signal thereto; a second output terminal of the MAC chip is connected to a first input terminal of the switch circuit for inputting cut-off controlling signal thereto; a cut-off controlling pin of the golden finger is connected to a second input terminal of the switch circuit for inputting cut-off controlling signal thereto; and an output terminal of the switch circuit is connected to a second input terminal of the laser driver. The switch circuit is used to connect the first or the second input terminal of the switch circuit with the output terminal. The cut-off controlling signal controls the switch-off of the laser.

Growing community of inventors

Shandong, China

Long Zheng