Advanced Technology Materials, Inc.

Finisar Corporation

Castlewood Systems, Inc.

Ii-vi Delaware, Inc.

Seagate Technology Incorporated

Thomas West, Inc.

Advanced Technologies Materials, Inc.

Long Van Nguyen

William A Wojtczak

David Daniel Bernhard

Ma Fatima Seijo

Syed H Iftikar

Albert J Guerini

Thomas H Baum

Cary Regulski

Frank Ivan Morris

George Guan

Donald J MacLeod

Kevin H Song

Stephen A Fine

Thomas E West

Peter McKeever

Matt Richardson

William H Wang

Robert Alan Nottingham

Feng Xu

Wei Wang

Shamei Shi

Huaping Peng

Ranran Zhang

Pepito Galvez

Peter G Robinson

Gary Quigley

Donald Dietz

Alireza Rahimi

Venkat R Koka

Willaim A Wojtczak

Naizhi Zhao

Dave Bernhard

Koli Holani

Ma Fatimo Seijo

Chong Heng

Jorge Craik

Fatima Ma Seijo

An example optoelectronic module includes a housing that extends between a first end and an opposite second end. The optoelectronic module includes a printed circuit board ('PCB') with an electrical connector at an end thereof, a transmitter electrically coupled to the PCB, a receiver electrically coupled to the PCB, and a receiving member including a plurality of ports each configured to receive a respective one of a plurality of fiber optic cables. In one aspect, the receiving member includes a plurality of deformable retaining members configured to be positioned in corresponding receptacles of the housing member in an arrangement structured to limit movement of the receiving member. In another aspect, the module also includes a plurality of fiber optic cable receptacles and a receptacle retaining member is positioned between the housing and the receptacles and limits movement of the receptacles in the housing.

Optoelectronic module for receiving multiple optical connectors

An example method of assembling an optoelectronic assembly may include aligning a receptacle with a sleeve that may have a radial flange and with a ferrule that may have a light propagation axis. The method may include axially displacing one or more of the receptacle, the sleeve, and the ferrule such that the receptacle may be positioned at least partially within the sleeve and may at least partially surround the ferrule. The method may include aligning a fiber stub that may have a fiber stub pigtail and a fiber stub flange with the receptacle. The method may include axially displacing one or both of the fiber stub and the receptacle such that the fiber stub may be positioned in close proximity with the ferrule. The method may include coupling the sleeve via the radial flange and the fiber stub via the fiber stub flange with a retention device.

Retention device for optoelectronic connections

A method for making a polishing pad includes rotating a cylinder about a central axis. The cylinder encloses in an interior space a polymer mixture. The method also includes forming the polishing pad from at least some of a polymer formed after the polymer mixture has gelled. The rotating of the cylinder may be continued until the polymer has cured. The method may include forming at least two distinct layers in the polishing pad by casting and gelling sequentially at least two different polymer mixtures. A system for manufacturing a polishing pad includes a centrifugal caster adapted to rotate. A polishing pad made by a method is provided.

Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods

A method for making a multilayer polishing pad includes rotating a cylinder about a central axis. The cylinder encloses in an interior space a single polymer mixture that phase separates under centrifugal force. The method also includes forming the polishing pad from at least some of a polymer formed after the polymer mixture has reacted. The method includes forming at least two distinct layers in the polishing pad by casting and gelling sequentially at least two different polymers.

Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads

A fiber optic connector may include a body, a first fiber ferrule, and a second fiber ferrule. The first fiber ferrule may extend in a length direction of the body from a module-side end of the body. The second fiber ferrule may extend in the length direction of the body from the module-side end of the body and may be spaced apart from the first fiber ferrule in a width direction of the body. A maximum width in the width direction of a portion of the body configured to be received in a port of an optoelectronic communication module may be less than half a width of a fiber-side end of the optoelectronic communication module.

Duplex mini LC connector

A communication module includes a printed circuit board, a housing including a left and right sidewall, a top and bottom panel, and a catch pin extending from the bottom panel, the housing enclosing the circuit board and configured to be inserted into and removed from the host device, and a delatch assembly slidably engaged with the bottom panel of the housing, including first and second delatch arms extending underneath the bottom panel of the housing and configured to removably engage with the host device, and a delatch cross-member extending underneath the bottom panel of the housing, including a hooking member configured to selectively engage the catch pin as the delatch assembly slides along the housing.

Latch for communication module

A communication assembly can include: a module device; a cage having a body defining a first open end that is configured to receive the module device therethrough and the body defining one or more first receiver members between the first end and a second end opposite of the first end, the one or more first receiver members having a first part of fastening system (e.g., two-part fastening system); and a heat sink adapted to be received into the cage so as to be thermally coupled with the module device, the heat sink having a body defining one or more second receiver members configured to receive the one or more first receiver members, the one or more second receiver members having a second part of the fastening system that couples with the first part of the fastening system.

Communication module assembly with heat sink and methods of manufacture

Latching mechanisms for pluggable electronic devices when received within a host cage of a host device. In one example embodiment, the host cage is configured to be connected to a host printed circuit board and configured to at least partially surround a host connector. The host cage includes a pair of inwardly biased leaf springs that extend toward the host connector and thereby engage with the latching mechanism of the pluggable electronic module in order to secure the pluggable electronic module within the host cage.

Latching mechanisms for pluggable electronic devices

In an example embodiment, a module latch mechanism includes a follower and a driver. The follower is configured to be slidingly positioned relative to a housing and to facilitate selective engagement of the housing with a host device. The follower includes a retaining member configured to retain a resilient member in at least one direction such that the resilient member urges the follower towards a first position relative to the housing. The driver is configured to be rotatingly positioned relative to the housing. The driver includes a cam configured to urge the follower towards a second position relative to the housing as the driver is rotated from a latched position to an unlatched position.

Latch mechanism for communications module

A semiconductor wafer cleaning formulation, including 1-35% wt. fluoride source, 20-60% wt. organic amine(s), 0.1-40% wt. nitrogenous component, e.g., a nitrogen-containing carboxylic acid or an imine, 20-50% wt. water, and 0-21% wt. metal chelating agent(s). The formulations are useful to remove residue from wafers following a resist plasma ashing step, such as inorganic residue from semiconductor wafers containing delicate copper interconnecting structures.

Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate

Latching mechanisms for pluggable electronic devices. In one example embodiment, a latching mechanism includes a driver and a follower. The driver is configured to rotate about an axis between a latched positioned and an unlatched position. The follower is operably connected to the driver and configured to slide axially along an electronic device toward the driver as the driver is rotated from the unlatched position to the latched position and slide axially along the electronic device away from the driver as the driver is rotated from the latched position to the unlatched position.

In one example, a pluggable module comprises a shell, a module connector, and one or more thumbscrews. The shell defines a cavity within which a PCB and one or more components are disposed and includes a front, back, first side, and second side. The module connector is operatively connected to the PCB near the back of the shell and extends from within the cavity to outside the shell through an opening defined in the back of the shell. The module connector is configured to operatively couple the pluggable module to a host device. The thumbscrews are housed within one or more portions of the shell and are configured to threadably secure the pluggable module to the host device. Each of the thumbscrews comprises a torque limiter. The pluggable module can further comprise protecting means for protecting a portion of the module connector extending outside the cavity from damage.

Thumbscrew for pluggable modules

Growing community of inventors

San Jose, CA, United States of America

Long Van Nguyen