National Taiwan University

Walsin Lihwa Corporation

Other

Gongin Precision Industries Co., Ltd.

Touch Micro-system Technology Corp.

Slight Opto-electronics Co., Ltd.

Walshin Lihhwa Corporation

Long-Sun Huang

Chih-Kung Lee

Shiming Lin

Yu-Hsiang Hsu

Yo-Hsin Su

Der-Chang Hsieh

Hsi-Lien Lu

Hsun-Min Lung

Ta-Chang Liu

Yao-Hui Kuo

Kai-Fung Chang

Chii-Wann Lin

Ta-Shun Chu

Shu Kuan

Ching-Heng Tang

Chau-Chung Wu

Shuen-Chen Shiue

Kuang-Chong Wu

Yang-Lin Chen

Hsien-Lung Ho

Pei-Zen Chang

Yu-Chen Chang

Chi-Yu Huang

Lung-Jieh Yang

Yi-Kuang Yen

Te-Son Kuo

Wen-Jong Chen

Ching-Hua Lee

Ying-Tsuen Liou

Jyh-Perng Chiu

Chao-Sen Chang

Chu-Wann Lin

Son-Nan Chen

Chung-Ho Tung

Su-Ming Hsu

Chien-Hsun Chen

Yu-Fu Ku

Der-Xing Liou

Ping-Yen Lin

The present disclosure relates to a valproic acid biosensor. In some embodiments, the valproic acid biosensor may comprise a microcantilever, a self-assembly monolayer, and a valproic acid antibody layer. The self-assembly monolayer may immobilize on the microcantilever surface. The valproic acid antibody layer may immobilize on the self-assembly monolayer. The valproic acid antibody layer may be used to bind with valproic acid drug samples. The present disclosure further relates to methods for measuring the concentration of valproic acid drug samples.

Valproic acid biosensor and method for measuring concentration of valproic acid

A system for compensating a thermal effect is provided and includes a substrate structure and a microcantilever. The substrate structure includes a first piezoresistor. The first piezoresistor is buried in the substrate structure and has a first piezoresistance having a first relation to a first variable temperature. The microcantilever has the thermal effect and a second piezoresistance having a second relation to the first variable temperature, wherein the thermal effect is compensated based on the first and the second relations.

Apparatus with temperature self-compensation and method thereof

A torsional MEMS device is disclosed. The torsional MEMS device includes a support structure, a platform, and at least two hinges, which connects the platform to the support structure. The platform has an active area and a non-active area. A plurality of sacrificial elements is disposed in the non-active area. If the resonant frequency of the torsional MEMS device is less than a predetermined standard resonant frequency of the torsional MEMS device, at least one sacrificial element is removed to reduce the total mass of the torsional MEMS device, and so as to increase the resonant frequency of the torsional MEMS device.

Method of modulating resonant frequency of torsional MEMS device

A tunable laser system is provided. The tunable laser system includes a light source, a grating, a corner mirror array, and a receiver. In which, the light source emits a beam, and the grating is located in front of the light source for reflecting the beam to form a first reflective beam. Also, the corner mirror array is located in front of the grating for receiving the first reflective beam and forms a second reflective beam accordingly. In addition, the receiver is used to receive a third reflective beam formed from reflecting the second reflective beam through the grating.

External cavity tunable laser system formed from MEMS corner mirror

A microarray biochip workstation allowing positioning of chips, immobilization of molecules, mixing of sample solution, molecular interactions and washing and processing qualitative and quantitative analyses consists of a positioning device for holding a biochip, a mixing device for acting on the sample solution applied on the biochip, a pumping device for removing the sample solution from the biochip surface that does not react, and a reading device for detecting reaction results of the biochip. The workstation thus constructed provides an integrated and effective work interface.

Array biochip workstation

A grating manufactured by a micro-structure gap control technique is provided in this invention. The grating includes a first structural part, a second structural part and a substrate. The first structural part includes a first micro-structure and a concavity, the second structural part includes a second micro-structure and an island structure located within the concavity, wherein a gap exists between the inland structure and the concavity. Further, the substrate is bonded to the first structural part and the second structural part for supporting the first structural part and the second structural part.

Micro-structure gap control technology and structure formed therefrom

A motion sensing system utilizing piezoelectric laminates with predetermined surface electrode patterns disposed thereon utilizes a frequency selector to pass motion waves of predetermined frequencies and an electrical circuit for processing the electrical signals for transmission to an activating device for appropriate activation. In particular, the frequency selector is a low frequency bandpass filter for free-fall acceleration wave frequencies. By directing appropriate action, the present invention increases the applicability of the device upon which it is mounted (e.g., for military or other hostile environment use), decreases the possibility of damage, and lengthens its useful life.

Piezoelectric laminate motion sensing apparatus and method

A method for manufacturing a grating is provided. The method includes the steps as follows: a) forming a first insulating layer on a substrate; b) forming a silicon oxide layer on the first insulating layer; c) forming and hard baking a photoresist on the silicon oxide layer for defining a plurality of specific zones; d) etching the first insulating layer and the silicon oxide layer within the specific zones respectively for forming a plurality of concaves; e) forming a second insulating layer on the silicon oxide layer; f) defining a plurality of grating zones onto the second insulating layer, and forming an adhesive layer and a conductive layer on the grating zones in sequence; g) removing parts of the second insulating layer located outside of the grating zones; and h) removing the silicon oxide layer for exposing a plurality of grating structures within the grating zone.

Method of manufacturing micro actuated blazed grating

The micro grating structure is provided. The micro grating structure includes a substrate; a first supporting structure and a second supporting structure; a first structure post and a second structure post, wherein the first structure post and the second structure post are mounted on the substrate between the first supporting structure and the second supporting structure; and a grating mounted between the first structure post and the second structure post and comprising a first, a second, a third and a fourth torsion beams, wherein the first and the second torsion beams are connected to the first and the second supporting structures respectively, the third and the fourth torsion beams are connected to the first and the second structure posts respectively, and the first, the second, the third and the fourth torsion beams are twisted by an electrostatic force so as to enable the grating to be inclined at an angle with respect to the substrate.

Micro grating structure

A biological cell test method and apparatus employs a conventional perforated cell carrier which has a plurality of holes. Each hole has two metal electrodes. A cell is disposed in the hole to contact the two electrodes. The electrodes are connected to electric current or voltage. The electric current or field flows from one electrode through the cell to another electrode. Through the inherent impedance, inductance or capacitance of the cell, the presence or property reactions of the cell may be detected.

Biological cell test method and apparatus

The present invention is a wafer level integrating method for bonding an un-sliced wafer including image sensors and a wafer-sized substrate including optical components thereon. A zeroth order light reflective substrate is provided between the un-sliced wafer and the wafer-sized substrate. The image sensors are either CMOS or CCD image sensors. The wafer-sized substrate is a transparent plate and the optical components thereon include a blazed grating, a two-dimensional microlens array or other optical-functional elements. The wafer-sized substrate is bonded onto the zeroth order light reflective substrate by an appropriate optical adhesive to form a composite substrate. Bonding pads and bumps are provided at corresponding positions on the bonding surface of the un-sliced wafer and the composite substrate respectively so that the composite substrate and the un-sliced wafer can be bonded together through a reflow process. Alternatively, the composite substrate and the un-sliced wafer can be bonded together by cold compression or thermal compression. The resultant wafer is then sliced into separated image sensors for further packaging, such as CLCC, PLCC, QFP, QFN or QFJ. Alternatively, the resultant wafer can be packaged through a wafer-level chip scale packaging process.

Method for integrating image sensors with optical components

A sensor system of a surface plasmon resonance (SPR) for analyzing a characteristic of a substance and the measuring method thereof are provided. The system includes an optical device for generating a first light beam and a second light beam in sequence; a sensor device for respectively generating a first plasmon wave and a second plasmon wave in response to an optical characteristic change of the first light beam and the second light beam with respective to the substance, in which a resonance is generated from the first plasmon wave and the second plasmon wave respectively generating a first reflective signal and a second reflective signal; and a measuring device for measuring spectra of the first reflective signal and the second reflective signal and obtaining the measured value which is substituted into an operational formula to calculate a reference value used for analyzing the characteristic of the substance.

Sensor system of surface plasmon resonance (SPR) and measuring method thereof

Growing community of inventors

Taipei, Taiwan

Long-Sun Huang