Mediatek Corporation

Long-Kun Yu

Tai-Yu Chen

Chin-Chiang Chang

Chia-Wei Chi

Chia-Feng Yeh

Wen-Wei Yang

Kuo-Liang Deng

The invention provides a portable electronic system. The portable electronic system includes a semiconductor package. The semiconductor package includes a substrate. A semiconductor die is coupled to the substrate. A thermoelectric device chip is disposed close to the semiconductor die, coupled to the substrate. The thermoelectric device chip is configured to detect a heat energy generated from the semiconductor die and to convert the heat energy into a recycled electrical energy. A power system is coupled to the semiconductor package, configured to store the recycled electrical energy.

Semiconductor package assembly with thermal recycling function

A high-speed-transmission connection device includes a male connector, a cable, and a metal protrusion structure. The cable is connected to the male connector. The metal protrusion structure is formed on an outer surface of the male connector. When the male connector is connected to a female connector, the metal protrusion structure is in close contact with the inner surface of the female connector. The metal protrusion structure fills a gap between the male connector and the female connector, and prevents electromagnetic waves from leaking outwardly from the gap.

High-speed-transmission connection device having a metal protrusion electrically connected to a connector

A method for performing chip level electromagnetic interference (EMI) reduction is provided, where the method is applied to an electronic device. The method includes: providing at least one EMI suppression circuit within at least one chip of the electronic device; and utilizing the at least one EMI suppression circuit within the at least one chip to perform EMI reduction on at least one signal within the at least one chip. In particular, the at least one chip includes a first chip and a second chip; and the at least one EMI suppression circuit includes a first EMI suppression circuit positioned within the first chip, and further includes a second EMI suppression circuit positioned within the second chip. An associated apparatus is also provided.

Method for performing chip level electromagnetic interference reduction, and associated apparatus

A power circuit for a power amplifier which operates in an inactive period and an active period is provided and includes a power supply unit, a current limiting unit, a storage unit, and a converting unit. The power supply unit provides a first current. The current limiting unit is arranged to process the first current to generate a second current. The storage unit is arranged to provide a storage voltage. The storage unit is charged by the second current during the inactive period and discharged by a third current during the active period. The converting unit provides an active power to the power amplifier according to the storage voltage, the second current, and the third current during the active period.

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Taipei, Taiwan

Long-Kun Yu