Beijing E. Motor Advance Co. Ltd.

Ac Propulsion, Inc.

Lon C Cooper

David L Bogdanchik

George R Woody

Wally Ewald Rippel

Paul F Carosa

Nayeem Arafat

Hung-Li Chang

A compact and thermally efficient traction drive motor inverter featuring an integrated printed circuit board carrying both power circuitry and signal circuitry on separate electrically isolated layers without significant electromagnetic interference. Electrical communication with subsequent electrically isolated layers is maintained through the use of plated blind vias. Thermal efficiency is improved by utilizing a liquid cooled insulated gate bipolar transistor module with featuring internal flow balancers to optimize coolant flow.

Compact thermally efficient traction motor inverter

An improved heat dissipation apparatus for limiting the temperature of multiple power semiconductors featuring flow balancers to manipulate the hydrodynamic pressure of the coolant fluid to regulate the coolant fluid flow distribution across the heat exchange fins to either create uniform flow distribution or purposefully disproportionate or custom coolant fluid flow distribution for the purpose of achieving higher heat transfer efficiency.

Heat dissipation apparatus and method for power semiconductor devices

A packaging and cooling apparatus for power semiconductor devices comprising a printed circuit board and a semiconductor module. The semiconductor module having a manifold element and a semiconductor element consisting of power semiconductor devices, thermally conductive plates, and serpentine fin elements. The power semiconductor devices and serpentine fin elements are bonded to the thermally conductive plates on opposing sides to form plate assemblies. The plate assemblies are installed in the windows of the manifold element forming the semiconductor module, which allows for heat removal from each of the power semiconductor devices. The terminals of the semiconductor module are received in the holes of the circuit board, and soldered to traces. The packaging and cooling apparatus may be potted with a resin to prevent leakage of coolant or sealing may be achieved by use of clamped o-rings.

Packaging and cooling method and apparatus for power semiconductor devices

Growing community of inventors

Azusa, CA, United States of America

Lon C Cooper