Qualcomm Incorporated

Lohith Kumar Vemula

Jonghae Kim

Bharani Chava

Abinash Roy

A package comprising a substrate and an integrated device coupled to the substrate. The substrate includes at least one dielectric layer, a plurality of interconnects comprising a first interconnect and a second interconnect, a capacitor located at least partially in the substrate, the capacitor comprising a first terminal and a second terminal, a first solder interconnect coupled to a first side surface of the first terminal and the first interconnect, and a second solder interconnect coupled to a second side surface of the second terminal and the second interconnect.

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San Diego, CA, United States of America

Lohith Kumar Vemula