Apple Inc.

Logan M Ames

Ricky C Lee

Lucy Elizabeth Browning

Duy P Le

Arman Hajati

John J Baker

Martin J Auclair

Yaocheng Zhang

Paul U Leutheuser

Michael M Li

Hailong Wang

Jere C Harrison

Jason C Law

Burak Metin

This disclosure describes features and methods of formation of a data port for a portable electronic device. The portable electronic device includes a device housing having a wall defining a data port opening. An anchoring feature is formed along a portion of the wall defining the data port opening. A structural support member is positioned within the data port opening and reinforces the data port opening. A polymer material fills a gap between the structural support member and a portion of the wall defining the data port opening. The polymer material engages the anchoring feature to retain the structural support member within the data port opening.

Structural support member for a data port of a device housing

A haptic actuator may include a housing, at least one coil carried by the housing, and a field member having opposing first and second sides. The haptic actuator may also include a respective at least one flexure bearing mounting each of the first and second sides of the field member to be reciprocally movable within the housing responsive to the at least one coil. Each flexure bearing may include two diverging arms joined together at proximal ends and having spaced distal ends operatively coupled between adjacent portions of the field member and the housing. The two diverging arms may each have a reduced size medial portion relative to respective proximal and distal ends.

Haptic actuator including flexure bearing having diverging arms each with a reduced size medial portion and related methods

An electronic device is disclosed. The electronic device may include an enclosure that includes a metal band and a wall. The electronic device may further include a filler compound positioned in an opening of the metal band, where a split between two sidewall components defines the opening. The filler compound provides an RF communication path through the enclosure. In order to reduce or prevent liquid ingress into the enclosure, the electronic device may include a sealing compound that infused into the opening between the filler compound and the sidewall components, thereby providing a seal. The infusion process including placing the metal band (with the filler compound) in a chamber, providing a vacuum to remove air between the metal band and the filler compound, and subsequently providing a positive pressure to force the sealing compound between the metal band and the filler compound. The sealing compound may include an adhesive.

Vacuum impregnation seal in an electronic device

Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.

Laser welding of transparent and opaque materials

Growing community of inventors

Palo Alto, CA, United States of America

Logan M Ames