Stmicroelectronics S.r.l.

Lo&iuml;c Renard

Battista Vitali

A method for forming and bonding a metal bump on a metal pad of an integrated circuit and successively stamping a vertex of the bonded metal bump is performed using the same capillary tool. The dielectric and refractory tip of the capillary tool ends with a flat surface forming a sharp edge adjacent a concave mouth formed therein. A preformed metal ball held in the concave mouth is bonded to the metal pad of the integrated circuit. The method further includes the step of retracting the capillary tool from the bonded metal bump while allowing free movement of the capillary tool relative to the metal wire passing through an axial conduit of the capillary tool. Relative movement of the metal wire is blocked by clamping the metal wire as soon as the capillary tool is pulled off the bonded metal bump. The capillary tool is then laterally shifted for breaking off the metal wire. The vertex of the bonded metal bump and a residual wire stump is stamped forming a substantially flat and leveled contact area by re-lowering the capillary tool previously misaligned from the bonded metal bump. The wire clamp is released and the capillary tool is lifted and moved to the next metal pad with a portion of the metal wire emerging from the concave mouth.

Growing community of inventors

Milan, Italy

Loïc Renard

Growing community of inventors

Milan, Italy

Lo&iuml;c Renard

Loïc Renard