Hitachi Energy Ltd

Hitachi Energy Switzerland Ag

Lluis Santolaria

Dominik Truessel

Harald Beyer

Samuel Hartmann

David Guillon

Milad Maleki

Fabian Fischer

Niko Pavlicek

Roman Ehrbar

Helder Mata

Georg Siroky

A power semiconductor component with power semiconductor modules connected to a cooling structure, and a cooling chamber having an inlet and outlet port, and adapted for a flow direction of a coolant substance from the inlet port to the outlet port, each of the cooling structures provided within the cooling chamber consecutively in the flow direction forming a flow resistance region in the cooling chamber, the cooling chamber comprises a bypass region connected in parallel to at least one of the flow resistance regions being closer to the inlet port, and is adapted for a flow rate of the at least one flow resistance region, which is connected in parallel to the bypass region, closer to the inlet port being smaller than a flow rate of one of the at least two flow resistance regions closer to the outlet port.

Power semiconductor component

A power module having an alignment part fixed on a lateral top surface (10T) of a semiconductor module component. The semiconductor module component has at least one terminal which—at least in places—is orientated vertically with respect to the lateral top surface of the semiconductor module component and for the purpose of alignment along lateral directions, is located at least partly within the at least one recessed portion. Along a vertical direction, the at least one terminalprotrudes beyond the at least one recessed portion. The at least one recessed portion is located on a side surface of the alignment part, wherein the at least one recessed portion is a vertical slot being an open recess on the side surface of the alignment part, and wherein the slot is not a through-hole being completely surrounded by inner walls of the at least one recessed portion in lateral directions.

Power module comprising a semiconductor module component and an alignment part, and method for forming the power module

A cooling assembly includes a first cooler part having an opening and an attachment point arranged on a first side of the first cooler part. The opening is configured to receive an integrated cooling structure of a corresponding semiconductor module that includes a baseplate to be attached to the attachment point on the first side of the first cooler part. A second cooler part is arranged on an opposite, second side of the first cooler part. The first cooler part and the second cooler part are made from a fiber reinforced polymer material and are joined so as to form a cavity for a coolant between the second side of the first cooler part and the second cooler part.

Power semiconductor module with injection-molded or laminated cooler assembly

A clamping element () is specified configured to be pressed to a baseplate () of at least one power semiconductor module () comprising a mold (), comprising —at least one contact area () being configured to be in direct contact to at least one clamping area () of the baseplate () being free of the mold (), and —at least one recess () provided in the baseplate, wherein —the recess () and the contact area () are configured to face the baseplate. Further, a method for producing a power semiconductor device is specified.

Clamping element and method for producing a power semiconductor device

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Olten, Switzerland

Lluis Santolaria