Intel Corporation

Lloyd L Pollard, Ii

Seri Lee

Steve J Lofland

Scott L Noble

Nitin B Gupte

Murli Tirumala

Chia-Pin Chiu

Michael W Williams

James M Dodd

Daryl James Nelson

James S Webb

Craig M Randleman

Jim Noval

The present invention provides for dynamic thermal management of integrated circuits, including memory modules, within a computer system. The thermal management methodology described herein closely couples software operation to hardware operation of the computer system, and allows each system to run at near optimum performance levels without exceeding specified maximum temperature thresholds. In order to achieve such results, the present invention relates physical characteristics of the integrated circuit with physical characteristics of the internal chassis environment, and translates this relationship into a maximum software performance setting. The system monitors and adjusts software performance such that the maximum performance setting is not exceeded.

Dynamic thermal management for integrated circuits

A heat dissipation system and method for extracting heat from an integrated circuit device includes a thermally conductive base having substantially planar upper and lower surfaces, the upper surface is disposed across from the lower surface, and the lower surface is adapted to contact an integrated circuit device. A conductive heat exchange portion including an array of fins extends angularly away from the upper surface of the base. The array has a chamber within to house an air movement device so that the air introduced by the air movement device creates a swirling air movement over the heat exchange portion to increase air movement around the heat exchange portion to enhance the heat extraction from the heat exchange portion.

Manufacturing process for a radial fin heat sink

An enhanced heat dissipation system and a method to extract heat from an integrated circuit device include a thermally conductive core having upper and lower outer surface areas. The system further includes a first conductive ring having a first array of radially extending fins. The first conductive ring is thermally coupled to the upper outer surface area. The first array and the lower outer surface area of the thermally conductive core are of sufficient size to allow components on a motherboard to encroach around and onto the integrated circuit device when the heat dissipation device is mounted onto the integrated circuit device.

Heat-dissipating devices, systems, and methods with small footprint

An integrated heat sink that can provide heat dissipation from multiple components mounted on a circuit board with each component having a different height dimension relative to each other is described. The heat sink has a first face on which a plurality of cooling fins are formed and a second face on which at least one pedestal is formed. The pedestal has a contacting surface to thermally couple to at least one of the multiple components to dissipate heat therefrom. The heat sink is designed to prevent a junction temperature at the contact area where the heat sink and each of the components abut one another from exceeding a maximum design value for the system. In one embodiment of the present invention, the heat sink has a groove formed in the second face. A conductive gasket is disposed in the groove and contacts a metal trace on the circuit board when the heat sink is attached to the circuit board to form a Faraday cage or EMI shield.

Integrated heat sink for different size components with EMI suppression features

A memory system includes a plurality of memory device ranks. A memory controller having a connection with the plurality of memory device ranks is adapted to obtain command information being issued to one of the plurality of memory device ranks. The memory controller is also adapted to generate a power weight value based on a command type from the command information. The memory controller increments a power count of the one of the plurality of memory device ranks by the power weight value generated. The memory controller then compares the power count of the one of the plurality of memory device ranks to a threshold value set for the one of the plurality of memory device ranks. If it is determined that the power count exceeds the threshold value, the memory controller is adapted to throttle the one of the plurality of memory device ranks.

Weighted throttling mechanism with rank based throttling for a memory system

A heat dissipation system and method for extracting heat from an integrated circuit device includes, in one example embodiment, a thermally conductive base plate. The heat dissipation system and method further includes an array of substantially parallel fin structures having top and bottom portions. The thermally conductive base plate is attached to the array such that the thermally conductive base plate is in close proximity to the bottom portion. The top and bottom portions extend outwardly from the thermally conductive base plate. The top portion of the array further extends laterally beyond the bottom portion of the array. The top and bottom portions of the array are of sufficient size so as to allow components on a motherboard to encroach around the integrated circuit device.

High performance fin configuration for air cooled heat sinks

A heat dissipation system and method for extracting heat from an integrated circuit device includes a thermally conductive post having substantially planar upper and lower surfaces, wherein the upper surface is disposed across from the lower surface, and wherein the lower surface is adapted to contact an integrated circuit device. A conductive heat exchange portion including an array of fins extends upwardly from the upper surface of the post where possible to allow components mounted on a printed circuit board to be positioned around the integrated circuit device. The heat exchange portion including the array has a chamber within to receive and house an air movement device so that the air introduced around the fins by the air movement device enhances the heat dissipation from the heat dissipation device.

High performance air cooled heat sinks used in high density packaging applications

An electronic assembly that may include a two-phase material that absorbs heat generated by an integrated circuit. The heat may be transferred from the integrated circuit to the two-phase material by a heat pipe. The two-phase material can absorb heat in an isothermal process utilizing the latent heat of the material. The isothermal process allows the two-phase material to absorb heat generated by the integrated circuit without raising the temperature of the assembly.

Transient cooling augmentation for electronic components

An electrical assembly which includes a heat sink that is pressed into an integrated circuit package by a spring fixture. The integrated circuit package is mounted to a substrate. Inserted through the spring fixture is a screw. The screw is also inserted through a clearance hole of the substrate and into an attachment hole of the heat sink to attach the heat sink to the substrate. Other features are disclosed.

Spring fixture that attaches a heat sink to a substrate for multiple

A modular cooling apparatus for computer systems is disclosed. The apparatus includes an air-guiding duct, a fan coupling to the duct and a coupling apparatus for coupling the air-guiding duct and the fan to an electronics housing. The air-guiding duct has an input opening to the exterior of the electronics housing and guides ambient outside air to the input of the fan. Then the fan directs this outside air to the inside of the electronics housing. The electronic housing can be formed between a base module and the computer system circuit board or between the air-guiding duct, fan and a retention module. Furthermore, outside air is delivered in a substantially perpendicular direction relative to the plane of the computer system circuit board within the electronics housing.

Fan duct module

An apparatus for dissipating heat generated by electronic components on a surface of a memory module and a method of assembling the apparatus are provided. The apparatus includes substantially identical first and second heat exchanger members, each having a heat spreader member thermally coupled to a heat sink member. The two heat exchanger members are positioned on opposing sides of a memory module and assembled together about the module. A surface of the heat spreader member is configured to engage electronic components on the surface of the memory module. A clip member protruding from an edge of each heat exchanger member is also provided. The first heat exchanger clip member is configured to engage an edge of the second heat exchanger member and the second heat exchanger clip is configured to engage an edge of the first heat exchanger member to releasably lock the first and second heat exchanger members together about the memory module.

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Portland, OR, United States of America

Lloyd L Pollard, Ii