Santa Barbara Research Center

Raytheon Company

Lloyd D Ingle

Leonard E Peck

Jose A Santana

Gary B Hughes

James P McDonald

Arthur V Schweidler

John D Koontz

Two components are bonded together in a bonding apparatus using a bonding medium of malleable metallic spheres and a curable adhesive. The two components are bonded by positioning the components in a facing-but-spaced-apart relation in the bonding apparatus with the spheres and the adhesive between the first component and the second component. The bonding apparatus forces the first component toward the second component with sufficient force to bond the spheres to the first component and to the second component, while monitoring at least one measured bonding reaction of the first component and the second component, and controlling the bonding apparatus responsive to the step of monitoring. The adhesive is thereafter cured, optionally with the bonding pressure released and the assembly removed from the bonding apparatus.

Fabrication method for adhesive pressure bonding two components together with closed-loop control

A method for bonding the ends of the conductors 52 to circuit pads 54 is disclosed whereby the cable 20 is placed over the circuit pads 54; a bonding tool 44 is pressed against an upper surface 58 of the cable 20; the substrate 46 of the cable 20 is compressed beyond its elastic limit; and ultrasonic energy is applied to the bonding tool 44 and transmitted through the substrate 46 to effect a metallic bond between the conductors 52 and circuit pads 54.

Method for bonding a flexible cable to an electrical component

A first piece (22) is bonded to a second piece (24) at a selected location (45) by positioning the first piece (22) and second piece (24) between a pair of bonding tools (36 and 38), with the bonding tools at the selected location (45) of the first piece (22) and the second piece (24) where bonding is to be achieved. The selected location (45) of the first piece (22) and the second piece (24) is pressed between the pair of bonding tools (36 and 38) with an applied force (46), the applied force (46) increasing from zero to a prebonding force (64), being maintained at the prebonding force (64) for a prebonding period (66), changing to a bonding force (60), and thereafter decreasing from the bonding force (60) to zero. Ultrasonic energy (48) is applied to the selected location (45) through at least one of the bonding tools (36 and 38), the ultrasonc energy (48) increasing to a prebonding energy (68) during the period that the applied force (46) is being increased from zero to the bonding force (60), being maintained at the prebonding energy (68) during at least a portion of the prebonding force period (66), changing to a bonding energy (72) prior to the time that the applied force (46) reaches the bonding force (60), and thereafter decreasing to zero.

Method for wire bonding

A thin film electrical cable 20 is disclosed having a polyimide substrate 46, a layer of titanium 48 on a lower side 50 of the substrate 46, and a plurality of gold conductors 52 on the titanium 48. The thin layers of titanium and gold are preferably sequentially deposited on a clean polyimide film by sputtering. Additional gold is electroplated and separate conductors are delineated. The use of organic adhesive materials to attach the conductors 52 to the substrate 46 is avoided.

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Lompoc, CA, United States of America

Lloyd D Ingle