International Business Machines Corporation

Lloyd Bernard Stearn, Jr

Michael Aaron Kaply

Walter Chun-Won Lee

Jonas Sicking

Methods, systems, and media to mount one or more components to a hardware casing are disclosed. Embodiments include hardware and/or software for determining a pattern of interconnects to apply to an interior surface of the hardware casing. The pattern includes at least one independent path for transmitting a signal between the components. The pattern of interconnects is then applied to the interior surface, the application being configured for the topography of the interior surface to couple the components with the pattern of interconnects. In many embodiments, the components may then be mounted to the casing and interconnected with the interconnects. And, in some embodiments the pattern of interconnects may be coupled with a circuit board having additional components.

Mounting components to a hardware casing

Methods, systems, and media to mount one or more components to a hardware casing are disclosed. Embodiments include hardware and/or software for determining a pattern of interconnects to apply to an interior surface of the hardware casing. The pattern includes at least one independent path for transmitting a signal between the components. The pattern of interconnects is then applied to the interior surface, the application being configured for the topography of the interior surface to couple the components with the pattern of interconnects. In many embodiments, the components may then be mounted to the casing and interconnected with the interconnects. And, in some embodiment, the pattern of interconnects may be coupled with a circuit board having additional components.

Growing community of inventors

Round Rock, TX, United States of America

Lloyd Bernard Stearn, Jr