Applied Materials, Inc.

Lizhong Sun

Stan D Tsai

Shijian Li

Feng Quan Liu

Liang-Yuh Chen

Rashid Mavliev

Siew Neo

Alain Duboust

Fred Conrad Redeker

Byung-Sung Kwak

John M White

Ratson Morad

Paul D Butterfield

Antoine P Manens

Ralph M Wadensweiler

Daniel A Carl

Fritz C Redeker

Yan Wang

Wei-Yung Hsu

Chong Jiang

Yonqi Hu

Xiaodong Yang

Yi Yang

Shou-Sung Chang

Quanyuan Shang

Yufei Chen

Doohan Lee

Jan Isidorsson

Xiao Dong Yang

Sen-Hou Ko

Jian J Chen

Brian T West

Yongqi Hu

Kyuil Cho

Yuchun Wang

Donald J K Olgado

Giback Park

Gopalakrishna B Prabhu

Ramin Emami

Ming-Kuei Tseng

Shi-Ping Wang

Miaojun Wang

Mark Roger Covington

Dimitrios Argyris

William M Lu

Chong Ma

Vivek Vinit

Vishal Agrawal

Yufei Zhou

Peng Liu

Jianjun Hu

Byung-sung Leo Kwak

Examples disclosed herein relate to an apparatus and method of forming thin film layers on a substrate. A first piezoelectric material layer is deposited on the substrate in a first chamber. The first piezoelectric material layer is formed on the substrate while the substrate is at a first temperature. A second piezoelectric material layer is deposited on the first piezoelectric material layer after cooling the substrate to a second temperature. The second temperature is lower than the first temperature. The first piezoelectric material layer and the second piezoelectric material layer both comprise a first piezoelectric material.

Method and apparatus for deposition of piezo-electric materials

Embodiments of the present disclosure generally provide apparatus for collecting and reuse polishing fluids and methods related thereto. In particular, the apparatus and methods provided herein feature a polishing fluid collection system used to collect and reuse polishing fluids dispensed during the chemical mechanical polishing (CMP) of a substrate in an electronic device manufacturing process. In one embodiment, a polishing fluid catch basin assembly includes a catch basin sized to surround at least a portion of a polishing platen and to be spaced apart therefrom. The catch basin features an outer wall, an inner wall disposed radially inward of the outer wall, and a base portion connecting the inner wall to the outer wall. The outer wall, the inner wall, and the base portion collectively define a trough. A radially inward facing surface of the inner wall is defined by an arc radius which is greater than a radius of the polishing platen the catch basin is sized to surround.

Polishing fluid collection apparatus and methods related thereto

Disclosed herein is an apparatus and method for fine tuning properties of a thin film. The method of forming a piezoelectric film includes (a) depositing a first piezoelectric film layer on a surface of a substrate by a first physical vapor deposition (PVD) process. The method includes (b) depositing a second piezoelectric film layer, on top of and in contact with the first piezoelectric film layer, by a second PVD process. A temperature of the substrate is (c) reduced after forming the first piezoelectric film layer and before forming the second piezoelectric film layer. The temperature is reduced by performing a process for a first period of time. Processes (a), (b) and (c) are additionally performed one or more times. Process (c) is performed for a second period of time. The second period of time is different than the first period of time.

Method and apparatus for tuning film properties during thin film deposition

A chamber includes a target () and a magnetron () disposed over the target (). The magnetron () includes a plurality of magnets (). The magnetron () has a longitudinal dimension and a lateral dimension. The longitudinal dimension of the magnetron () is tilted with respect to the target () so the distances between magnets () and the target () vary. As the magnetron () rotates during operation, the strength of the magnetic field produced by the magnetron () is an average of the various strengths of magnetic fields produced by the magnets (). The averaging of the strengths of the magnetic fields leads to uniform film properties and uniform target erosion.

Tilted magnetron in a PVD sputtering deposition chamber

Methods and apparatus are used for adjusting film stress profiles on substrates. An apparatus may include a PVD chamber with a pedestal configured to support a substrate during processing on a cover positioned on an uppermost surface of the pedestal. The cover is constructed with multiple electrodes such as, for example, a first electrode, a second electrode, and a third electrode. The second electrode is positioned between and electrically separated from the first electrode and the second electrode. A substrate stress profile tuner is electrically connected to the first electrode, the second electrode, and the third electrode and configured to independently adjust an RF voltage level of at least the second electrode and the third electrode relative to RF ground to produce a more uniform film stress profile.

Methods and apparatus for zone control of RF bias for stress uniformity

The present disclosure provides methods for forming a metal containing material onto a substrate with good film uniformity and stress profile across the substrate. In one embodiment, a method of sputter depositing a metal containing layer on a substrate includes supplying a gas mixture into a processing chamber, forming a first portion of a metal containing layer on a substrate, transferring the substrate from the processing chamber, rotating the substrate, transferring the substrate back to the processing chamber, and forming a second portion of the metal containing layer on the first portion of the metal containing layer.

Method and apparatus for depositing a metal containing layer on a substrate

Embodiments of the disclosure generally relate to a process kit including a shield serving as an anode in a physical deposition chamber. The shield has a cylindrical band, the cylindrical band having a top and a bottom, the cylindrical band sized to encircle a sputtering surface of a sputtering target disposed adjacent the top and a substrate support disposed at the bottom, the cylindrical band having an interior surface. A texture is disposed on the interior surface. The texture has a plurality of features. A film is provided on a portion of the features. The film includes a porosity of about 2% to about 3.5%.

Pre-conditioned chamber components

Approaches herein provide a device, such as a battery protection device, including a cathode current collector and an anode current collector provided atop a substrate, a cathode provided atop the cathode current collector, and an electrolyte layer provided over the cathode. An interlayer, such as one or more layers of silicon, antimony, magnesium, titanium, magnesium lithium, and/or silver lithium, is formed over the electrolyte layer. An anode contact layer, such as an anode or anode current collector, is then provided over the interlayer. By providing the interlayer atop the electrolyte layer prior to anode contact layer deposition, lithium from the cathode side alloys with the interlayer, thus providing a more isotropic or uniaxial detachment of the anode contact layer.

Energy storage device having an interlayer between electrode and electrolyte layer

The present invention relates to sputter targets for electrochemical device layer deposition comprising a lithium-containing target material with near-metallic electrical conductivity which includes (a) at least one metal and (b) a lithium-containing material, the lithium-containing material being selected from the group consisting of lithium metal and a lithium-containing salt, wherein the at least one metal and the lithium-containing material are formed into the lithium-containing target material and wherein the lithium-containing target material is configured with a composition sufficient for physical vapor deposition of a lithium-containing electrode of the electrochemical device in a single step, the lithium-containing electrode as deposited requiring no further lithium doping. Furthermore, the composition of the metallic lithium-containing target material may be configured to provide a low enough electrical resistance to permit DC sputtering. Chambers and tools including the sputter target and process flows for fabricating electrochemical devices including steps utilizing the sputter target are also described.

Lithium containing composite metallic sputtering targets

A system for use in substrate polishing includes a conditioner system for conditioning a surface of a polishing pad and a vacuum system having a vacuum port. The conditioner system includes a conditioner head constructed to receive an abrasive conditioner component. The vacuum system is configured to apply suction through the vacuum port to the surface of the polishing pad in a direction away from the surface to remove material on the surface.

Polishing pad conditioning system including suction

The present invention relates to vacuum-deposited solid state electrolyte layers with high ionic conductivity in electrochemical devices, and methods and tools for fabricating said electrolyte layers. An electrochemical device may comprise solid state electrolytes with incorporated thin layers and/or particles of transition metal oxides, silicon, silicon oxide, or other suitable materials that will induce an increase in ionic conductivity of the electrolyte stack (for example, materials with which lithium is able to intercalate), or mixtures thereof. An improvement in ionic conductivity of the solid state electrolyte is expected which is proportional to the number of incorporated layers or a function of the distribution uniformity and density of the particles within the electrolyte. Embodiments of the present invention are applicable to solid state electrolytes in a broad range of electrochemical devices including thin film batteries, electrochromic devices and ultracapacitors. The solid state electrolyte layers may be nominally pinhole-free.

Pinhole-free solid state electrolytes with high ionic conductivity

The present invention generally relates to electrochemical devices, such as electrochromic (EC) devices and thin film batteries (TFB), and in particular to anodes of electrochemical devices with improved intercalation and/or transport properties. Some embodiments of the invention include anodes, such as nickel oxide, doped with Si, Sn, SiOand/or SnO, which may be in the form of nanoparticles or even substituted atoms/molecules. These nanoparticles/substituted atoms, which have higher lithium intercalation capability, distort the lattice of the anode, improving movement and intercalation of Li ions. In some other embodiments, the anode may be formed of silicon oxide and/or tin oxide, which materials have good transport and intercalation of Li ions.

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Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a cell for polishing a substrate includes a processing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper planarizing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. In another embodiment, a system is provided having a bulk processing cell and a residual processing cell. The residual processing cell includes a biased conductive planarizing surface. In further embodiments, the conductive element is protected from attack by process chemistries.

Method and apparatus for electrochemical mechanical processing

Blue inks for displays are provided. In one aspect, the blue inks include one or more blue organic pigments, one or more monomers, one or more polymeric dispersants, and one or more organic solvents. In another aspect, the blue inks include one or more blue organic pigments, one or more violet pigments, one or more monomers, one or more polymeric dispersants, and one or more organic solvents. Methods of forming displays that include dispensing the blue inks by inkjetting onto a substrate and displays that include the blue inks are also provided.

Blue printing ink for color filter applications

Green inks for displays are provided. In one aspect, the green inks include one or more green organic pigments, one or more monomers, one or more polymeric dispersants, and one or more organic solvents. In another aspect, the green inks include one or more green organic pigments, one or more yellow pigments, one or more monomers, one or more oligomers, one or more polymeric dispersants, and one or more organic solvents. Methods of forming displays that include dispensing the green inks by inkjetting onto a substrate and displays that include the green inks are also provided.

Green printing ink for color filter applications

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San Jose, CA, United States of America

Lizhong Sun