Applied Materials, Inc.

Quantum Global Technologies LLC

Liyuan Bao

Samantha S H Tan

Anbei Jiang

Joseph Frederick Sommers

Yukari Nishimura

Sio On Lo

Ken Mun Loo

In one aspect, a method of cleaning an electronic device manufacturing process chamber part is provided, including a) spraying the part with an acid; b) spraying the part with DI water; and c) treating the part with potassium hydroxide. Other aspects are provided.

Methods and apparatus for cleaning deposition chamber parts using selective spray etch

Non-metallic deposits are selectively removed from aluminum containing substrates such as aluminum faceplates using a selective deposition removal (SDR) solution. The SDR solution does not substantially etch the faceplate holes, thereby preserving the hole diameter integrity and increasing the number of times the faceplate may be cleaned or refurbished while remaining within processing hole diameter tolerances. In an embodiment, the SDR solution comprises, in wt % of the solution, 15.5%+/&#x2212;2% HF or buffered HF acid, 3.8%+/&#x2212;0.5% NHF pH buffer, 59.7%+/&#x2212;5% ethylene glycol, and the balance HO.

Non destructive selective deposition removal of non-metallic deposits from aluminum containing substrates

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Freemont, CA, United States of America

Liyuan Bao